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DRAMeXchange, a division of TrendForce, reports that demand continues to outpace supply in the server DRAM market. In this first quarter, memory suppliers saw their shipment fulfillment rates dropped for different groups of clients. The fulfillment rate for long-term agreement (LTA) orders was 80% on average, while fulfillment rates for orders from Chinese and Taiwanese ODMs fell to the 60% level. Due to the persistent undersupply, DRAMeXchange further projects that the global average sales price (ASP) of server DRAM will increase by more than 10% between the first and second quarter.
DRAMeXchange, a division of TrendForce, reports the general price increase in the PC DRAM market is growing larger than anticipated as the already tight supply situation is compounded by quality problems with products made on the leading-edge processes. Based on a preliminary survey of completed contracts for the second quarter, DRAMeXchange estimates that the average contract price of 4GB DDR4 modules will go up by about 12.5% compared with the first quarter, from US$24 to around US$27.
Intel has made waves in the server SSD market with the reveal of its Optane SSD DC P4800X Series this March. Based the company’s in-house 3D XPoint memory, the DC P4800X Series is scheduled for shipments in the second half of 2017. “3D XPoint greatly outperforms NAND Flash and will help Intel reinforce its leading position in the high-end segment of the SSD market that has become increasingly competitive,” said Alan Chen, senior research manager of DRAMeXchange, a division of TrendForce. “In the future, the product roadmap of 3D XPoint could include client-grade SSDs and storage-class memory (SCM) devices. Intel naturally wants to expand the adoption of this technology in other areas as to create flexibility in pricing and consumption of in-house production capacity.”
Global smartphone production volume for the first quarter of 2017 totaled 307 million units, a drop of 23% from the previous quarter, according to market intelligence firm TrendForce. Smartphone brands, especially those based in China, lowered their production volume forecasts through the first quarter as demand slowed down significantly due to the conventional seasonal effect.
United Semiconductor Xiamen (USCXM), China-based subsidiary of major foundry UMC, is reported to begin production on the 28nm technology licensed from its parent company this second quarter. As international semiconductor companies set up fabrication plants in China, the country’s domestic foundries will face intensifying competition in terms of technology, market share and recruitment of technical personnel. According to the global market intelligence firm TrendForce, Semiconductor Manufacturing International Corporation (SMIC) and Shanghai Huali Microelectronics Corporation (HMLC) are the two leaders among Chinese foundries in the development of the 28nm processing. The existence of foreign-owned fabs in China will pressure these two domestic manufacturers to further accelerate their timetables for this technology.
