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Broadcom Limited Again Topped TrendForce’s Latest Revenue Ranking of Top 10 IC Design Houses Worldwide for Second Quarter

16 August 2017

Broadcom Limited, Qualcomm and NVIDIA respectively took first, second and third place in TrendForce’s latest ranking of the global top 10 fabless IC design houses for the second quarter of 2017. With MediaTek and Marvell as exceptions, the eight other design houses in the top 10 ranking posted year-on-year revenue growth.

Second-Quarter Server DRAM Revenue of the Top Three Suppliers Rose by 30.1% Sequentially on Tight Supply, Says TrendForce

14 August 2017

For this second quarter, the total server DRAM revenue of the global top three DRAM makers – Samsung, SK Hynix and Micron – jumped by 30.1% compared with the prior quarter, as ASPs of server DRAM products remained high on continuing undersupply, says DRAMeXchange, a division of TrendForce. Despite product mix adjustments, suppliers had difficulty meeting the various growing demands in the DRAM market.

TrendForce Reports 4.6% Sequential Monthly Gain for Average Contract Price of PC DRAM Modules This July and Expects It to Keep Rising This Third Quarter

7 August 2017

DRAM prices began to rise in the second half of 2016 and have maintained a strong upward momentum through the first half of 2017, according to data from DRAMeXchange, a division of TrendForce. The average contract price of PC DRAM modules rose by nearly 40% sequentially in the first quarter to US$24 and then by more than 10% sequentially in the second quarter to US$27. Furthermore, the average contract price of PC DRAM modules increased by about 4.6% between this June and July. DRAMeXchange’s price forecast for this year’s second half indicates and steady and incremental gains as the general trend in the DRAM market.

TrendForce Says Latest Fab Plans in China Will Need Government Subsidies to Minimize Risks of Losses in Short/Medium Term

2 August 2017

TrendForce’s latest research on semiconductor fab plans in China after 2016 finds that a total 17 new fabs are slated for construction so far. Five of these plants will be for processing 8-inch wafers and the remaining 12 plants will be for processing 12-inch wafers. New fab projects will carry high depreciation costs, and the aggressive recruitment efforts by semiconductor manufacturers will raise the cost of personnel needed for fab operation. Furthermore, prices of bulk silicon wafers have gone up as the strong demand for them worldwide has outpaced the overall supply. Within the short/medium term, the construction and operation of these new fabs poses enormous financial risks for their owners.

TrendForce Forecasts Size of Global Market for Smart Manufacturing Solutions to Top US$320 Billion by 2020; Product Development Favors Integrated Solutions

31 July 2017

Industry 4.0 is a concept that has attracted a lot of attention in the global marketplace since its emergence in 2012. Following this conceptual framework, manufacturing companies in various industries have embarked on a mission to transform their operations by deploying smart technologies. TrendForce’s ongoing coverage of smart manufacturing solutions indicates that investments in related hard- and software have been growing steadily. Furthermore, this market is seeing rising demand and a trend towards integrated solutions. TrendForce forecasts that the size of the global market for smart manufacturing solutions will surpass US$320 billion by 2020.


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