Southeast Asia is fast becoming a key semiconductor hub, particularly in advanced packaging, attracting major players to expand their regional footprint. Taiwan-based chip packaging giant ASE announced a strategic partnership with Analog Devices (ADI) on Oct. 21, signing a binding MoU to acquire ADI...

According to Liberty Times, TSMC Vice President of Advanced Packaging Technology and Service Jun He said demand for the company’s advanced packaging services is booming, with customers pressing closely. In response, TSMC is working to shorten timelines and accelerate capacity. He also stressed tha...

According to Commercial Times, ASE said on the 11th that its subsidiary ASE Semiconductor will acquire a plant and related facilities from Taiwan’s GaAs foundry WIN Semiconductors in the Southern Taiwan Science Park, Kaohsiung, for NT$6.5 billion. Approved by the board, the purchase is aimed at e...

Just ahead of the reciprocal tariffs taking effect on August 7, U.S. President Trump announced plans to slap a 100% tariff on imported chips. According to Politico, the U.S. imported over $60 billion worth of chips in 2024, with Taiwan emerging as the top supplier at roughly $12 billion. As a result...

According to Economic Daily News, fan-out panel-level packaging (FOPLP) is regarded as the next mainstream technology in advanced packaging. Key industry players—including foundry giant TSMC, semiconductor packaging and testing leader ASE, and memory packaging powerhouse Powertech—are actively i...