[News] UMC and ASE Weigh Price Increases in Booming Advanced Packaging Market

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According to a report by Taiwan’s Economic Daily, TSMC is aggressively expanding its advanced packaging capacity. Recently, they placed an additional 30% order for equipment with manufacturers, leading to a doubling of order volumes for companies in the interposer supply chain, such as UMC and ASE Group. Moreover, there are rumors of price increases on the horizon.

TSMC, responding to the robust production demands from major clients like NVIDIA, AMD, and Amazon, has not only expanded its CoWoS capacity as originally planned but has also added another 30% in new equipment. This move implies that once TSMC’s new advanced packaging capacity comes online next year, it will represent at least a doubling of the current production capacity.

Given the substantial demand for TSMC’s advanced packaging orders, coupled with the necessity of interposer in CoWoS for stacking logic computing ICs and high-bandwidth memory, there is an expectation of significant growth in interposer orders, likely exceeding a twofold increase compared to this year. Notably, semiconductor giants like UMC and ASE Group have already secured significant orders from TSMC for interposer layers and are currently in the mass production and delivery stages.

It is understood that UMC, after venturing into the advanced packaging market in recent years, has introduced packaging solutions applicable to IoT, automotive chips, and more, spanning from wafer bumping and wire bonding packaging to advanced 2.5D, 3DIC, and wafer-level fan-out packaging solutions. The most notable among them is the 2.5D silicon interposer layer solution, which, through collaboration with UMC and other specialized packaging facilities, has proven pivotal in securing major orders in the interposer layer market, particularly from NVIDIA.

Industry sources suggest that UMC has increased prices for super hot run interposer layer orders and initiated capacity expansion plans to meet customer demands, while ASE Group is also contemplating adjustments to its advanced packaging quotations.

(Photo credit: UMC)