AI-driven semiconductor demand is reportedly fueling another round of price increases across the OSAT industry. According to MoneyDJ, citing industry sources, ASE, the world's leading outsourced semiconductor assembly and test (OSAT) provider, has raised its packaging quotes by more than 20%, driven...

TSMC continues to accelerate its advanced packaging capacity expansion, helping move the industry closer to supply-demand balance. According to Economic Daily News, institutional investors said that as TSMC and its partners aggressively build out new advanced packaging capacity, the CoWoS supply-dem...

As AI-driven demand continues to strain advanced packaging and testing capacity, SPIL, a subsidiary of ASE, is accelerating its expansion efforts. According to Investor.com, the company has acquired Taiwan Mask Corporation's Zhunan Plant 6 for NT$2.8 billion. Because the facility is already operati...

As TSMC’s CoWoS capacity crunch continues, Intel’s EMIB has emerged as a strong alternative, with IC design leader MediaTek reportedly adopting a dual advanced packaging strategy. According to Commercial Times, MediaTek is accelerating its expansion into AI ASICs and data center markets, while i...

The AI compute race is heating up, pushing advanced packaging to the forefront, with TSMC’s CoWoS emerging as one of the most constrained resources in the global AI supply chain. According to Commercial Times, sources say the average selling price (ASP) of a single CoWoS wafer is around $10,000—...