Previously, speculation circulated that NVIDIA might reduce its CoWoS orders from TSMC. However, according to Economic Daily News, TSMC’s advanced packaging orders have experienced an upsurge. Sources indicate that NVIDIA’s latest Blackwell architecture GPU chips are in strong demand, and the...

Recently, leading foundries GlobalFoundries and TSMC have both ramped up efforts in advanced packaging, while the U.S. Department of Commerce has increased subsidies for advanced packaging technologies. GlobalFoundries Invests $575 million in Advanced Packaging and Photonics Center On January ...

According to a report from Economic Daily News, TSMC plans to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP), with an estimated investment exceeding NTD 200 billion. Construction at the STSP Phase III site is expected to begin as early as March 2025, a...

Ahead of TSMC’s earnings call on January 16th, market rumors have been circulating that the foundry giant’s largest clients are slashing their CoWoS-S orders. According to Commercial Times, AMD and Broadcom are reportedly releasing the CoWoS-S capacity they previously booked due to slowing deman...

Ahead of TSMC’s earnings call on January 16th, the foundry giant’s capacity expansion plans remains a key focus, as the market is curious about its progress of Arizona plant and its CoWoS (Chip on Wafer on Substrate) output. Notably, the company has reportedly seen positive progress in both a...