According to Economic Daily News, fan-out panel-level packaging (FOPLP) is regarded as the next mainstream technology in advanced packaging. Key industry players—including foundry giant TSMC, semiconductor packaging and testing leader ASE, and memory packaging powerhouse Powertech—are actively i...

Amid surging demand for advanced packaging, key materials are now hot commodities for tech giants. According to EE Times China and the Economic Daily News, Japan’s Asahi Kasei, a top PSPI (photosensitive polyimide) supplier to semiconductor firms like TSMC and Samsung, plans to cut PIMEL shipments...

As the chip war heats up, the U.S. BIS unveiled an updated semiconductor whitelist on February 4, per its website. Commercial Times reports that the list, split into IC design (IW) and packaging & foundry (PW) categories, is likely to spark a shift in chip orders from China—a boost for Taiwan�...

On January 16, Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding, officially inaugurated its new advanced packaging facility at the Tanzi Science Park. SPIL also announced that three additional advanced packaging facilities are set to expand production capacity by 2025....

The rapid development of AI, HPC, and other technologies is driving higher demands for semiconductor performance and energy efficiency. Traditional packaging technologies struggle to meet the needs of the AI era, creating an opportunity for advanced semiconductor packaging technologies to shine. ...