AI-driven semiconductor demand is reportedly fueling another round of price increases across the OSAT industry. According to MoneyDJ, citing industry sources, ASE, the world's leading outsourced semiconductor assembly and test (OSAT) provider, has raised its packaging quotes by more than 20%, driven...

As TSMC accelerates development of CoPoS (Chip-on-Panel-on-Substrate), Taiwan OSAT leader ASE is also making steady progress in fan-out panel-level packaging (FOPLP). According to TechNews, citing COO Tien Wu at the June 24 shareholders’ meeting, ASE’s first fully automated high-volume productio...

As AI-driven demand continues to strain advanced packaging and testing capacity, SPIL, a subsidiary of ASE, is accelerating its expansion efforts. According to Investor.com, the company has acquired Taiwan Mask Corporation's Zhunan Plant 6 for NT$2.8 billion. Because the facility is already operati...

The AI chip race is intensifying across the board, with advanced packaging growing in significance and driving a surge in OSAT capital spending. According to Commercial Times, Taiwan-based OSAT players ASE, Powertech, and King Yuan Electronics (KYEC) are expected to see their combined capital expend...

Since April 2026, global semiconductor packaging and testing sector has seen a wave of major developments. ASE has kicked off its largest-ever fab construction program, with six new facilities slated to break ground worldwide this year. Meanwhile, Samsung Electronics plans to invest USD 4 billion in...