With Trump’s inauguration in January, "Made in America" is expected to dominate, driving an urgent push for semiconductor packaging and equipment companies to relocate to North America. Coupled with TSMC’s Arizona plant set to start mass production early next year, the Commercial Times reports t...

Driven by booming demand for AI chips, TSMC's advanced CoWoS (Chip on Wafer on Substrate) packaging faces a significant supply shortage. In response, TSMC is expanding its production capacity and is considering price increases to maintain supply chain stability. According to a recent report from ...

To turn adversity around, Intel launched its latest AI accelerator, Gaudi 3, in late September. However, a report by the Economic Daily News indicates that the struggling giant has significantly slashed the chip’s shipment targets by over 30% for next year, which may severely impact orders for its...

The surging global demand for AI chips is straining advanced packaging capacity, driving a sharp focus on fan-out panel-level packaging (FOPLP) within Taiwan's semiconductor industry. According to a report by Commercial Times, major packaging and testing firms such as ASE and Powertech, alongside eq...

According to a report by the Commercial Times, while TSMC, the global foundry leader, has established a plant in Kikuyo, Kumamoto City, Kyushu. ASE Technology Holdings (ASE), a giant in packaging industry, is setting up a plant in Kitakyushu as well. With these developments, Japan's semiconductor ...