AI-driven semiconductor demand is reportedly fueling another round of price increases across the OSAT industry. According to MoneyDJ, citing industry sources, ASE, the world's leading outsourced semiconductor assembly and test (OSAT) provider, has raised its packaging quotes by more than 20%, driven...

TSMC is strengthening its U.S. advanced packaging supply chain through a new long-term partnership with Amkor. According to an Amkor press release, the two parties have announced a 10-year agreement to enhance advanced packaging capabilities in Arizona and support further investment in the U.S. semi...

Japan’s food seasoning maker Ajinomoto, which has also become a key supplier of chip packaging materials, is accelerating the expansion of its semiconductor-related business. According to a company press release, Ajinomoto, through its consolidated subsidiary Ajinomoto Fine-Techno Co. (AFT), will ...

The AI chip race is intensifying across the board, with advanced packaging growing in significance and driving a surge in OSAT capital spending. According to Commercial Times, Taiwan-based OSAT players ASE, Powertech, and King Yuan Electronics (KYEC) are expected to see their combined capital expend...

China’s chip packaging firm SJ Semiconductor has successfully listed on the STAR Market. According to 21jingji, SJ Semiconductor (SJSemi) has officially debuted on the Shanghai Stock Exchange’s STAR Market, raising a total of about RMB 5 billion in its IPO, making it the largest fundraising in C...