TSMC has continued to ramp up investment in advanced packaging. According to Commercial Times, alongside its transition to a 2nm process for the A20-series chip used in the iPhone 18, Apple is set to upgrade packaging technology from the current InFO (Integrated Fan-Out) process to WMCM (Wafer-Level...

ASE has been actively expanding on the back of AI-driven demand for advanced packaging. According to Economic Daily News, ASE has made another expansion move, with its subsidiary SPIL on the 13th spending NT$2.801 billion to acquire a plant in Zhunan, Miaoli, previously owned by United Renewable Ene...

Apple’s iPhone 18 is already drawing industry attention, with rumors around its chip packaging further raising expectations. According to Wccftech, citing Weibo tipster Fixed Focus Digital, Apple may shift from InFO (Integrated Fan-Out) to WMCM (Wafer-level Multi-Chip Module) packaging for its A20...

TSMC has been actively expanding its advanced packaging capacity. According to MoneyDJ, the company held an opening ceremony for its AP7 facility in Chiayi, Taiwan, on the 4th. Supply chain sources note that Phase 2 of AP7 has recently begun equipment installation and testing, with production expect...

While TSMC has long dominated the advanced packaging landscape, Team Blue's technology is reportedly gaining traction. According to Wccftech, Intel’s EMIB and Foveros technologies are seeing growing interest, with Apple and Qualcomm posting job openings seeking talent experienced in its EMIB packa...