According to ZDNet, Samsung Electronics is developing System-on-Panel (SoP), an advanced semiconductor packaging technology. The report notes that if SoP advances quickly, Samsung could secure a role in Tesla’s next-generation Dojo packaging supply chain. At present, Tesla plans to have its “AI6...

According to Commercial Times, ASE said on the 11th that its subsidiary ASE Semiconductor will acquire a plant and related facilities from Taiwan’s GaAs foundry WIN Semiconductors in the Southern Taiwan Science Park, Kaohsiung, for NT$6.5 billion. Approved by the board, the purchase is aimed at e...

Taiwan's second-largest foundry, UMC, is stepping up its efforts in advanced packaging. According to a report from Commercial Times, sources say the company is considering acquiring the facility of TFT-LCD panel maker HannStar in the Southern Taiwan Science Park, which could be used to develop fut...

TSMC is actively expanding its advanced packaging capacity. According to Economic Daily News, the company originally planned to move equipment into its AP7 advanced packaging facility in Chiayi, Taiwan during the third quarter, but suppliers have reportedly received updated notices pushing the timel...

Samsung is continuing to strengthen its foundry operation and is reportedly planning to adopt glass substrates for chip packaging, according to Wccftech citing etnews. The South Korean tech giant intends to replace the traditional silicon interposer with a glass interposer by 2028, as the report not...