Since April 2026, global semiconductor packaging and testing sector has seen a wave of major developments. ASE has kicked off its largest-ever fab construction program, with six new facilities slated to break ground worldwide this year. Meanwhile, Samsung Electronics plans to invest USD 4 billion in...

TSMC holds its earnings call today, with its response closely watched amid rising industry interest in rival Intel’s advanced packaging technologies, including EMIB. In response, according to TechNews, TSMC Chairman and CEO C.C. Wei states that the company continues to offer the industry’s large...

China’s drive for semiconductor self-reliance is advancing, with fresh momentum in advanced packaging. According to South China Morning Post, SJ Semiconductor, a key player in China’s advanced chip packaging sector, has secured approval to list on Shanghai’s STAR Market. The report notes that ...

As back-end processes take on a larger role in the AI chip era, advanced packaging equipment is rising in strategic importance. According to Hankyung, leading chip equipment makers—including ASML, Applied Materials, Tokyo Electron (TEL), and Lam Research—are moving decisively into the advanced p...

TSMC is scheduled to hold a media tour in Chiayi on the 22nd, marking the first time its Chiayi AP7 site will be opened to local media. According to Commercial Times, construction at TSMC’s Chiayi facilities is progressing at full speed. Supply-chain sources note that AP7 Plant 2 began equipment i...