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TrendForce: SK Hynix’s Wuxi Fab to Recover Fully from Fire Damage by Mid-January 2014

12 December 2013

According to DRAMeXchange, a division of global research firm TrendForce, damages from the September 4 fire at SK Hynix’s DRAM fabrication plant in Wuxi, China caused a month-long cease in production, and global DRAM supply decreased by 10% in one single month. Therefore, commodity DRAM price trend, initially projected to fall in the second half of the year, has risen by nearly 20% since the fire. Average contract price for 4GB DRAM reached a high of US$33 in the second half of November. However, SK Hynix placed top priority on resuming operations at the Wuxi fab, immediately sending in hundreds of experts to begin the recovery process and working round the clock to decontaminate the clean room. Shortly after the incident, the memory makers replaced some of the fire-damaged equipment with machinery from its M11 fab, and newly purchased equipment has recently been moved into the Wuxi fab. Currently, SK Hynix is on track for a full recovery by mid-January. TrendForce provides the following update with the latest details regarding the recovery of the Wuxi fab:

TrendForce: Mobile DRAM to Become Mainstream within Industry, Account for 40% of DRAM Revenue in 2014

12 December 2013

According to DRAMeXchange, a research division of TrendForce, the impressive sales of smartphones and tablets have prompted DRAM manufacturers to gradually shift their focus from PC DRAM to Mobile DRAM since 2010. The proportion of DRAM revenues accounted for by the latter has risen from 14% in 2010 to about 35% this year, and is expected to show continuous growth in the next two years. Based on comparisons of the supply bit growth figures, Mobile DRAM is likely to not only replace PC DRAM as the mainstream DRAM product in 2014, but also show the largest shipment numbers within the industry.

TrendForce: DRAM Industry Outlook Positive for 2014, Annual Sales Growth Likely to Exceed 10%

5 December 2013

According to DRAMeXchange, a research division of TrendForce, 2013 has been a critical year for the DRAM industry. Benefiting from the rising smartphone and tablet sales, the first tier DRAM manufacturers gradually shifted their attention to Mobile DRAM, a move which caused the eventual decline in PC DRAM production; In the periods following the fire accident at SK Hynix's Wuxi plant, 4GB module contract prices rose from US$17 to US$33, and gave DRAM manufacturers greater room for profit.

TrendForce: Shipment Delays Resulting from Yield Rate Issues Lead to Positive Turnaround for 2H’Nov DRAM Contract Prices

2 December 2013

According to DRAMeXchange, a research division of TrendForce, the 2H13 DRAM prices were initially expected to weaken due to SK Hynix's gradual recovery from the fire accident and the sluggish demand in the market. However, with one of the first tier PC DRAM makers experiencing various shipment delays and resorting to other DRAM manufacturers for orders, the 2H'Nov contract prices experienced a positive turnaround. The highest price and average of 4GB mainstream modules have showed an estimated 3% increase and reached US$ 35 and US$ 33, respectively. For the 2GB modules, the prices reached up to as high as US$ 18.5 given the massive reductions in its supply.

TrendForce: NAND Flash Industry Structure to Transform as OCZ Declares Bankruptcy

2 December 2013

Affected by intensified competition and increased financial pressures, the renowned US-based SSD company, OCZ Technology, declared bankruptcy on 11/27 and announced its plans to sell assets to the Japanese NAND Flash manufacturer, Toshiba. The acquisition proposal has officially been approved by US courts, and for now, OCZ’s operations remain unchanged. As the merger begins to take place, more and more changes are expected to emerge in the SSD industry.


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