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IC Manufacturing, Package&Test


2025-07-08

[News] Samsung Q2 Profits Reportedly Dive to Six-Quarter Low; 2H Revival Faces Tariff Challenges

IC Manufacturing, Package&Test

Samsung's struggles with HBM3E verification for NVIDIA continue to weigh on its performance, offering no lift to its second-quarter results. According to Yonhap and the Chosun Daily, Samsung’s Q2 operating profit plunged nearly 56% to 4.6 trillion won—well below analysts’ expectations of 6 tri...

2025-07-07

[News] Infineon Accelerates GaN Push While TSMC Exits, with 300mm Wafer Samples Expected 4Q25

IC Manufacturing, Package&Test

While TSMC plans to exit the gallium nitride (GaN) wafer foundry business by 2027, industry heavyweight Infineon is ramping up its efforts. Leveraging its strong IDM model, Infineon, according to its press release, is advancing its scalable GaN production on 300mm wafers, with first customer samples...

2025-07-07

[News] UMC Reportedly Lands Qualcomm Deal for Advanced Packaging, Mass Production in 1Q26

IC Manufacturing, Package&Test

As UMC looks beyond mature nodes to drive growth, Economic Daily News suggests that the Taiwanese foundry has landed a major advanced packaging order from Qualcomm. Its self-developed high-end interposer has passed Qualcomm’s verification and is now nearing mass production, the report adds. UMC...

2025-07-07

[News] Samsung Reportedly Bets on 4–7nm with 30% Price Gap over TSMC, Eyeing Markets China Hasn’t Entered

IC Manufacturing, Package&Test

While Intel has shifted focus to 14A from 18A in a strategic trade-off, Samsung has reportedly made its compromises by prioritizing on 2nm and 4nm instead of 1.4nm, as per ZDNet. Meanwhile, Chosun Biz reveals that the struggling semiconductor giant also plans to boost demand in sub-7nm processes—s...

2025-07-04

[News] Chipmaking Giant ASML Reportedly Joins Call to Postpone EU AI Rules by Two Years

IC Manufacturing, Package&Test

With key parts of the EU’s landmark AI Act set to take effect as early as August, over 40 European CEOs—including chipmaking tool giant ASML and big techs Philips and Siemens—are calling for a two-year delay, warning that rushing the rollout could hurt Europe’s global competitiveness and sta...

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