While TSMC’s Arizona expansion races ahead, its Japan operations are moving at a slower pace, drawing close attention. Plans for Kumamoto Fab 2, however, may be shifting. A Nikkei report had suggested a move to 4nm—originally planned for 6nm and 7nm—but Mirror Media now reports a bolder plan: ...

With glass substrates gaining traction as a next-generation packaging solution, Japan’s Dai Nippon Printing (DNP) is stepping up its efforts. According to EE Times Japan, the company will begin phased operations of its newly established pilot line for TGV (Through-Glass Via) glass core substrates ...

Global IDM leaders are charting contrasting strategies in the GaN sector. NXP reportedly plans to phase out its radio power product line and close its GaN RF fab in Arizona by 2027, while onsemi is taking an aggressive approach, partnering with GlobalFoundries to co-develop and produce advanced GaN ...

Amid China’s push to consolidate its semiconductor industry and strengthen chip self-sufficiency, AMEC—the country’s leading domestic supplier of etching and thin-film deposition tools—announced on December 18 plans to acquire a controlling stake in Sizone Technology, according to chinastart...

Apple’s iPhone 18 is already drawing industry attention, with rumors around its chip packaging further raising expectations. According to Wccftech, citing Weibo tipster Fixed Focus Digital, Apple may shift from InFO (Integrated Fan-Out) to WMCM (Wafer-level Multi-Chip Module) packaging for its A20...