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IC Manufacturing, Package&Test


2026-01-08

[News] China Foundry Push Accelerates with Nexchip RMB 35.5B Phase IV, Hua Hong’s RMB 8.2B Deal

IC Manufacturing, Package&Test

Recent developments in China’s semiconductor sector signal an accelerated pace of expansion, particularly in the wafer foundry segment. Nexchip Kick-Started Construction of Phase IV Project with Investment of CNY 35.5Bn On January 4, 2026, Nexchip Semiconductor announced via its official WeC...

2026-01-07

[News] China’s Lithography Push: AMIES Takes Full Shareholding in SMEE Subsidiary in Asset Restructuring

IC Manufacturing, Package&Test

As China accelerates its semiconductor consolidation, its footprint is extending into lithography machines, one of the most advanced sectors of chipmaking equipment. According to ICRANK, Shanghai Weiyao Industrial Co., Ltd. has recently undergone a shareholder change, with Shanghai Micro Electronics...

2026-01-02

[News] Earnings Call Preview: TSMC 2nm in Focus — Capacity, Sales Contribution, and More

IC Manufacturing, Package&Test

Ahead of TSMC’s earnings call on January 15, the company quietly confirmed that its 2nm process entered mass production on schedule in 4Q25. With the market now expecting more details at the briefing, here are some of the key things to watch as this long-anticipated node steps into the spotlight. ...

2026-01-02

[News] China’s Chip Consolidation Heats Up: Hua Hong Acquires 97.5% of Huali, Following SMIC’s Earlier Move

IC Manufacturing, Package&Test

As 2025 drew to a close, China’s chip industry was accelerating its consolidation push. After SMIC unveiled plans to acquire the remaining 49% stake in its Beijing subsidiary in a 40.6 billion yuan ($5.8 billion) share-based deal, the country’s second-largest foundry, Hua Hong Semiconductor, ann...

2026-01-02

[News] China’s Big Fund Phase III Backs IC Substrate Maker AKM Meadville

IC Manufacturing, Package&Test

Recently, Guotou Jixin (Beijing) Equity Investment Fund (Limited Partnership) (“Guotou Jixin”), an investment vehicle under the Phase III China Integrated Circuit Industry Investment Fund Co., Ltd. (the “Big Fund Phase III”), has taken an equity stake in IC substrate maker AKM Meadville (Xia...

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