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IC Manufacturing, Package&Test


2025-10-30

[News] GlobalFoundries CFO Departs Ahead of €1.1 Billion Expansion in Germany

IC Manufacturing, Package&Test

U.S.-based semiconductor manufacturer GlobalFoundries is undergoing a major leadership change. The company announced that, effective immediately, John Hollister, its Chief Financial Officer, has departed. Hollister leaves the chipmaker after just over a year in the role, having been appointed as Glo...

2025-10-28

[News] Intel Reportedly Eyes Retired TSMC Veteran Wei-Jen Lo, Advanced Node Pioneer, to Lead R&D

IC Manufacturing, Package&Test

As the race for sub-2nm dominance intensifies among foundries, Intel is reportedly targeting a recently retired TSMC executive to spearhead its key R&D efforts. According to Liberty Times, just three months after retiring, former TSMC Senior Vice President of Corporate Strategy Development Wei-J...

2025-10-28

[News] Apple Reportedly Takes Most of TSMC’s 2nm Capacity for A20 Series in Foldable iPhone and iPhone 18

IC Manufacturing, Package&Test

Apple’s first foldable iPhone—expected in 2026 and reportedly featuring a design similar to Samsung’s Galaxy Z Fold, according to Bloomberg—is drawing strong market attention. Yet its biggest upgrade may lie inside: the device will run on Apple’s new A20 Pro chip, built on TSMC’s 2nm pro...

2025-10-28

[News] Infineon’s Chief Marketing Officer Joins Wolfspeed

IC Manufacturing, Package&Test

Wolfspeed has announced a major executive appointment: former Infineon executive Matthias Buchner has joined the company as Senior Vice President of Global Sales and Chief Marketing Officer (CMO), which will take effect on December 1, 2025. The move underscores Wolfspeed’s determination to acce...

2025-10-27

[News] China’s First Fully Automated 8-Inch MEMS Line Commences Production

IC Manufacturing, Package&Test

Recently, China Electronics System Engineering No. 2 Construction Co., Ltd. (CESE2) announced the successful roll-out of the first batch of products from the 8-inch MEMS wafer production line project at the China Bengbu Sensor Valley. This marks China's first fully automated 8-inch MEMS wafer produc...

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