IC Manufacturing, Package&Test


2021-06-08

How Will the COVID-19 Outbreak in KYEC Facilities Affect the Taiwanese Semiconductor Industry?

As infections among employees from semiconductor backend testing leader KYEC make news headlines, the company suspended operations for two days and undertook facility-wide disinfections starting on June 4, although at the moment KYEC’s facility has yet to resume operations at full capacity. In the vicinity of KYEC are packaging and testing operator Greatek and networking device manufacturer Accton, both of which have since been affected by the spread of the disease.

Not only have the confirmed cases in KYEC generated worries about possible disruptions to the semiconductor supply chain, but the semiconductor industry is also anxious about whether continued infections will spread to other semiconductor companies.

As a leading chip tester (as well as the 8th largest IC package and testing companies globally), if KYEC were to halt its operations altogether due to the continued spread of COVID-19 infections, the semiconductor supply chain would be considerably impaired as a result. Not only would upstream clients (including fabless companies, IDMs, and foundries) have their schedules disrupted, but lead times of downstream end-products will be prolonged as well, causing far-reaching impacts throughout the entire semiconductor industry.

According to KYEC’s publicly disclosed information, the distribution of its clientele is as follows: fabless companies (76%), IDMs (22%), and foundries (2%). In particular, of the 50 largest semiconductor companies globally, more than 30 currently make use of KYEC’s testing services.

According to TrendForce’s latest investigations, the packaging and testing industry has been impacted in the short run by KYEC’s two-day suspension and low-capacity operation resumptions successively. As such, MediaTek, Novatek, and STMicroelectronics, which are major clients of KYEC, are all notably experiencing impacts from the spread of the pandemic within KYEC’s ranks.

Although the above companies have already transferred some of their orders to ASE, Sigurd, and ChipMOS to make up for disruptions in KYEC’s operations, these orders are too numerous to be fulfilled completely at the present. Therefore, the tight capacity of chip testing services is expected to intensify going forward.

(Cover image source: Pixabay)

2021-01-13

TSMC to Kick off Mass Production of Intel CPUs in 2H21 as Intel Shifts its CPU Manufacturing Strategies, Says TrendForce

Intel has outsourced the production of about 15-20% of its non-CPU chips, with most of the wafer starts for these products assigned to TSMC and UMC, according to TrendForce’s latest investigations. While the company is planning to kick off mass production of Core i3 CPUs at TSMC’s 5nm node in 2H21, Intel’s mid-range and high-end CPUs are projected to enter mass production using TSMC’s 3nm node in 2H22.

In recent years, Intel has experienced some setbacks in the development of 10nm and 7nm processes, which in turn greatly hindered its competitiveness in the market. With regards to smartphone processors, most of which are based on the ARM architecture, Apple and HiSilicon have been able to announce the most advanced mobile AP-SoC ahead of their competitors, thanks to TSMC’s technical breakthroughs in process technology.

With regards to CPUs, AMD, which is also outsourcing its CPU production to TSMC, is progressively threatening Intel’s PC CPU market share. Furthermore, Intel lost CPU orders for the MacBook and Mac Mini, since both of these products are now equipped with Apple Silicon M1 processors, which were announced by Apple last year and manufactured by TSMC. The aforementioned shifts in the smartphone and PC CPU markets led Intel to announce its intention to outsource CPU manufacturing in 2H20.

TrendForce believes that increased outsourcing of its product lines will allow Intel to not only continue its existence as a major IDM, but also maintain in-house production lines for chips with high margins, while more effectively spending CAPEX on advanced R&D. In addition, TSMC offers a diverse range of solutions that Intel can use during product development (e.g., chiplets, CoWoS, InFO, and SoIC). All in all, Intel will be more flexible in its planning and have access to various value-added opportunities by employing TSMC’s production lines. At the same time, Intel now has a chance to be on the same level as AMD with respect to manufacturing CPUs with advanced process technologies.

(Cover image source: Taiwan Semiconductor Manufacturing Company, Limited )

For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms. Latte Chung from the Sales Department at lattechung@trendforce.com

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