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IC Manufacturing, Package&Test


2025-06-19

[News] Wolfspeed Reportedly to Be Taken Over by Apollo-Led Creditors Amid Bankruptcy, with Rivals Set to Gain

IC Manufacturing, Package&Test

Nearly a month after rumors surfaced about an imminent bankruptcy, a clearer picture has emerged: Wolfspeed is now on the verge of a major shake-up. Creditors led by Apollo Global Management are preparing to take control under a bankruptcy plan, according to Reuters, citing Bloomberg. The reports...

2025-06-19

[News] Fierce Battle Over 2nm Chip Manufacturing: Significant Yield Gap

IC Manufacturing, Package&Test

In the ongoing race within the semiconductor industry, TSMC and Samsung Electronics are fiercely competing to lead in 2nm chip manufacturing. As per recent reports, both companies plan to begin mass production of 2nm chips in 2H25. However, TSMC is at an advantage in securing orders due to its super...

2025-06-17

[News] Intel’s Rumored July Layoffs May Slash 15-20% of Factory Jobs, Oregon Hit Hardest

IC Manufacturing, Package&Test

Intel had hinted at more layoffs starting in July, but a memo seen by OregonLive now suggests the cuts could be far deeper than expected—reportedly slashing up to 20% of its factory workforce, striking at the core of its chipmaking business. According to the report, in the memo, Intel VP Naga C...

2025-06-17

[News] Huawei’s Quad-Chiplet 910D Reportedly Takes Shape with Advanced Packaging to Challenge NVIDIA

IC Manufacturing, Package&Test

Backed by founder Ren Zhengfei’s belief that advanced packaging and stacking can keep China in the advanced chip race, Huawei has reportedly filed a patent for a quad-chiplet design—likely linked to its next-gen AI chip, the Ascend 910D, per Tom’s Hardware. The report suggests that it could...

2025-06-17

[News] Coherent Unveils Breakthrough Diamond-SiC Material, Targeting AI and HPC Applications

IC Manufacturing, Package&Test

As artificial intelligence (AI) and high-performance computing (HPC) enjoy burgeoning growth, chip power consumption is highly on the rise—making heat dissipation a critical bottleneck limiting performance and reliability. On June 13, U.S.-based Coherent announced the launch of its breakthrough di...

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