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TrendForce announces a revised forecast for 2023 server shipments, protecting a downward shift of 5.94% YoY. This downward revision is attributed to various economic challenges, including Meta’s diminished demand for 2H23 and a sluggish start in China’s internal tech demand in 1H23 (including state-owned cloud and East-West computing projects).
The global server market, grappling with the impact of worldwide inflation, saw significant shifts in 2023. Server OEMs and CSPs revamped their investment strategies, resulting in cutbacks in both annual shipments and ODM production plans. TrendForce observes that as the server market continues to decline, demand for AI surges. These combined factors have had a domino effect, compressing the rollout of new server platforms across the board.
TrendForce highlights in its latest report that memory suppliers are boosting their production capacity in response to escalating orders from NVIDIA and CSPs for their in-house designed chips. These efforts include the expansion of TSV production lines to increase HBM output. Forecasts based on current production plans from suppliers indicate a remarkable 105% annual increase in HBM bit supply by 2024.
TrendForce reports that the HBM (High Bandwidth Memory) market's dominant product for 2023 is HBM2e, employed by the NVIDIA A100/A800, AMD MI200, and most CSPs' (Cloud Service Providers) self-developed accelerator chips. As the demand for AI accelerator chips evolves, manufacturers plan to introduce new HBM3e products in 2024, with HBM3 and HBM3e expected to become mainstream in the market next year.
TrendForce reports that MLCC suppliers are also experiencing a resurgence, with their monthly average BB ratio—a key market indicator—rising from 0.84 in April to 0.91 in early July. In tandem, total shipment volume saw a remarkable 12% growth, climbing from 345 billion units in March to 389 billion units in June.