Amidst geopolitical influences, governments worldwide are enticing semiconductor manufacturers with subsidy policies, prompting chip manufactures to establish themselves in various regions. The ongoing dynamics of semiconductor facility construction and the evolving global production capacity remain focal points for the industry in 2024.

Following TSMC’s establishment of facilities in Arizona, USA, and Kumamoto, Japan, the progress of TSMC’s second Kumamoto plant has garnered significant industry attention. On another front, the developments at TSMC’s ESMC facility in Germany continue to capture global attention within the semiconductor industry.

Powerchip Semiconductor Corporation (PSMC) also made headlines in 2023 by announcing the construction of its first overseas 12-inch fab, JSMC, located in Sendai City, Miyagi Prefecture, Japan.

Meanwhile, Samsung’s overseas expansion efforts are equally robust. In addition to its Taylor plant in the United States, Samsung plans to establish a new semiconductor packaging research center in Japan.

According to TrendForce data, considering an equivalent foundry capacity of 12 inches, Taiwan held a global market share of approximately 47% in 2023, followed by China at 26%, South Korea at 12%, the United States at 6%, Singapore at 4%, Japan at 2%, Germany at 1%, and others at 2%. By 2027, Taiwan’s market share is projected to decrease to 42%, with China at 28%, South Korea at 10%, the United States at 7%, Singapore at 6%, Japan at 3%, Germany at 2%, and others at 1%.

(Image: TSMC)

After a rebound from the decline in NAND prices, the current quotations still show a gap from reaching the breakeven point for suppliers such as Samsung, Kioxia, SK Hynix, and Micron.

Major domestic players in the NAND Flash industry indicate that NAND Flash suppliers, driven by the goal of profitability, will continue to aggressively raise prices. It is anticipated that prices will need to increase by over 40% once again for major manufacturers to break even. To achieve profitability, future price hikes are expected to be at least 50% or even higher, according to Economic Daily News.

Looking at the global NAND Flash market share in 3Q23, according to a report from TrendForce, Samsung holds the leading position with a market share of 31.4%. The second position is held by the SK group, with a market share of 20.2%, followed by the U.S.-based Western Digital at third place with a market share of 16.9%. The Japanese company, Kioxia ranks fourth with a market share of approximately 14.5%.

The industry indicates that due to the lower profitability of NAND Flash compared to DRAM, international giants are actively reducing NAND Flash production.

Taking Samsung as an example, since September of this year, the reduction in NAND chip production has expanded to 50% of total capacity, focusing on products with stacked layers up to 128 layers. The goal is to accelerate destocking and stabilize prices, with plans to gradually increase prices in 2024.

TrendForce has indicated that following Samsung’s expansion of the production reduction to 50%, other suppliers are also maintaining a restrained wafer allocation strategy. After more than half a year of production reduction in some processes and capacities, there is a structural supply shortage, providing an advantage for chip manufacturers in price control. Observing the market in the fourth quarter, there are almost no low-priced sources available for purchase. However, buyers still tend to maintain high inventory levels and continue purchasing.

Industry sources revealed that the NAND chip prices had plummeted too deeply before. Although the quarterly increase in contract prices seems substantial, there is still a distance for chip manufacturers to achieve a turnaround. It is expected that prices need to increase by another 40% to allow suppliers to cross the breakeven point. Therefore, prices are expected to be quite strong in the coming quarters.

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• NAND Flash Industry Revenue Grows 2.9% in 3Q23, Expected to Surge Over 20% in Q4, Says TrendForce
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(Photo credit: Samsung)

South Korean media Businesskorea reports that Samsung Electronics Co. has postponed the production schedule for its new semiconductor plant in Taylor, Texas to 2025.

Citing a report from Seoul Economic Daily, Siyoung Choi, the President of Samsung’s semiconductor foundry business, mentioned during a speech in San Francisco that Samsung’s new Tyler Plant – with investment of USD 17 billion – is now expected to commence production in 2025.

Samsung’s initial projection, announced in 2021 when the investment plan was disclosed, had anticipated the Taylor plant to start its mass production in the second half of 2024.

Even before the news of Samsung’s Taylor plant production delay, TSMC’s Arizona fab, “Fab 21,” had already decided to postpone its mass production to 2025 due to tool-in and various labor-related issues.

Reportedly, the delays in production schedules for both TSMC and Samsung indicate that the new semiconductor fab of these two companies will not enter mass production until 2025.

As per the report, industry sources point out that issues such as environmental permit challenges and slow progress in government subsidy policies are major obstacles hindering the development of semiconductor projects in the United States.

Read more

• [News] TSMC’s Arizona Plant Rumored for Q1 2024 Trial Production, Securing Orders from Three U.S. Clients
• [News] Samsung Reportedly to Open New Research Lab for Advanced Packaging in Yokohama, with a Total Investment of JPY 40 Billion

(Photo credit: Samsung)

After more than two years of stagnation in the memory market, which was exacerbated by production cuts from major players like Samsung and Micron earlier this year, the issue of overstock has finally seen improvement.

As per Nikkei’s report, this has driven an increase in prices for DRAM, marking the first such occurrence in nearly two and a half years. Observers are optimistic that the memory market will hit bottom this year, with a recovery and growth expected in 2024.

According to TrendForce’s data, the contract price for the DDR4 8GB, considered a benchmark product for DRAM, reached USD 1.50 in October, a 15.4% increase from September and the first increase since July 2021. The contract price for the same product continued to rise in November by 10%, reaching USD 1.65.

In addition to the DDR4 8GB product, other specifications of DRAM contract prices generally experienced monthly increases of around 10% in October this year. Generally, memory contract prices are determined collaboratively by chip suppliers and corporate customers, and an increase in contract prices signifies an advantage for suppliers.

There are signs of a bottoming out and rebound in the DRAM market in the third quarter of this year. TrendForce indicated that the global DRAM market’s revenue increased by 18% compared to the previous quarter, reaching USD 13.48 billion.

This growth, reportedly, is primarily attributed to production cuts by major suppliers throughout the year, gradually restoring balance to the market supply and demand.

The report also reflects on the pandemic period, noting that the global surge in remote work initially led to a sharp increase in demand for memory. However, as the pandemic gradually subsided in 2021, market demand cooled.

Additionally, persistent challenges such as high inflation and interest rates impacting consumer spending weakened demand for PCs and various consumer electronic devices. This, in turn, led to global oversupply in memory, causing prices to decline consistently.

Major DRAM manufacturers, including Samsung, SK Hynix, and Micron, have been reducing production since the beginning of this year, and they have recently managed to reverse the downturn.

Samsung reported a 16% revenue growth in the third quarter, while SK Hynix achieved an impressive growth rate of 34.4%. Despite a decline in average selling prices, Micron’s third-quarter chip shipment growth contributed to an overall revenue growth of 4.2%.

Moreover, the global NAND Flash market saw a 2.9% sequential increase in revenue in the third quarter, and a growth rate of 20% is anticipated for the fourth quarter, according to TrendForce’s latest research.

Read more

• [Insights] Due to Year-End Sluggish Demand, Spot Prices Hover for DRAM and NAND Flash
• [News] After Memory Price Hike, Shortages Emerge in Some Products?

(Photo credit: Samsung)

Samsung Electronics and South Korean internet giant Naver have joined forces to invest in an artificial intelligence semiconductor solution. According to BusinessKorea’s report, the energy efficiency of the first solution chip from the two companies is expected to be roughly eight times higher than competitors like NVIDIA H100.

This new solution is based on a Field-Programmable Gate Array (FPGA) customized for Naver’s HyperCLOVA X large language model.

Samsung and Naver began their collaboration at the end of 2022, utilizing Samsung’s advanced process technology, expertise in memory technologies like computational storage, processing-in-memory (PIM) and processing-near-memory (PNM), as well as Compute Express Link (CXL). Naver’s strengths in software and AI algorithms are also leveraged in this collaboration.

Samsung has already produced and sold various types of memory and storage technologies for AI applications, including SmartSSD, HBM-PIM, and memory expansion modules with CXL interfaces, all crucial for the upcoming AI chips.

“Through our collaboration with NAVER, we will develop cutting-edge semiconductor solutions to solve the memory bottleneck in large-scale AI systems,” said Jinman Han, Executive Vice President of Memory Global Sales & Marketing at Samsung Electronics.

Read more

• [News] Memory Market Gradually Recovering, Samsung and SK Hynix Raise Q4 Financial Outlook
• [News] Memory Giants Samsung & Micron Actively Embrace DDR5 and HBM as Favorable Choices

(Photo credit: Samsung)