As SK hynix reportedly targets mass production of 375-layer NAND by year-end, according to The Elec, the 400-layer threshold is increasingly seen as a key technical frontier in advanced NAND scaling. Against this backdrop, ET News notes that Samsung began mass producing its 286-layer NAND in Apri...

Samsung Electronics is reportedly looking to expand its advanced packaging capacity. According to Hankyung, sources say the company is pursuing plans to build an advanced packaging plant in Gwangju. Samsung Electronics is expected to announce the investment as early as the end of this month at a mee...

Following Jensen Huang's high-profile meetings with SK hynix during his South Korea visit, Samsung Electronics Vice Chairman Jun Young-hyun met with the NVIDIA CEO on June 8 to discuss potential cooperation in HBM and foundry services. According to The Chosun Daily, Jun said the discussions focused ...

As Apple reportedly sets its sights high for its first foldable iPhone, Samsung appears to be taking a more cautious approach. According to ZDNet, the company plans to ship 5–6 million units of its three new foldable models in 2026, including the Galaxy Z Fold8, Z Flip8, and Wide Fold, compared wi...

Laser annealing adoption appears to be broadening. According to ETNews, the thermal treatment process is expanding beyond its traditional use in silicon (Si) wafers to silicon carbide (SiC), a material widely regarded as a leading candidate for next-generation power semiconductors. The report adds t...