As TSMC’s CoWoS capacity crunch continues, Intel’s EMIB has emerged as a strong alternative, with IC design leader MediaTek reportedly adopting a dual advanced packaging strategy. According to Commercial Times, MediaTek is accelerating its expansion into AI ASICs and data center markets, while i...

SK hynix is reportedly exploring cooperation with Intel in advanced 2.5D packaging, a move that could signal potential shifts in the AI chip packaging supply chain. According to ZDNet, sources say SK hynix is conducting R&D on Intel’s EMIB-based 2.5D packaging technology using its own HBM, whi...

At Carnegie Mellon University’s honorary doctorate ceremony, Lip-Bu Tan personally congratulated Jensen Huang on receiving an honorary doctorate in science and technology, drawing fresh industry attention to the growing ties between Intel and NVIDIA. According to Wccftech, Tan not only praised Hua...

While recent market chatter has focused on a potential shift by Apple between longtime foundry partner TSMC and Intel, the Economic Daily News, citing industry sources, reports that the Cupertino-based company remains heavily dependent on the Taiwanese foundry giant, as it plans to place its entire ...

With less than a month remaining until COMPUTEX, the PC industry’s biggest annual event, expectations for this year’s show appear more subdued than usual. According to Zhu Shi’s column on TechNews, the PC market has been hit by soaring memory prices this year, leading to a noticeable decline i...