As Intel gains traction with its 18A and 14A nodes, its advanced packaging business — particularly EMIB (Embedded Multi-die Interconnect Bridge) — is also drawing customer support amid tight substrate supply. Speaking at the J.P. Morgan Global Technology Conference, Intel CEO Lip-Bu Tan said sev...

Intel’s turnaround appears to be gaining momentum. According to CNBC, Intel CEO Lip-Bu Tan said the company’s foundry business is making progress, with 18A process yields now improving by 7% to 8% per month, signaling advancement from earlier challenges. More significantly, Tan said the impro...

As AI accelerator leaders such as NVIDIA continue rolling out chips with increasingly larger compute die sizes, panel-level packaging is gaining momentum. Notably, Germany-headquartered SCHMID — an equipment provider for printed circuit board (PCB) and IC substrate manufacturing — said in an Inv...

The first laptops powered by Intel’s “Wildcat Lake” Core Series 300 processors for the entry-level PC segment are reportedly nearing launch. According to Wccftech, Intel Core Series 3 laptops could hit retail shelves as early as next week, with initial models including 14-inch and 16-inch desi...

Shortly after Google unveiled its upcoming Googlebook lineup, Intel confirmed on X that its chips will power the new platform, saying it is “thrilled” to partner with the search engine giant and describing the devices as “premium, powerful ones designed for intelligence.” With technical deta...