As advanced packaging becomes increasingly important, glass substrates are drawing growing industry attention. According to Business Post, SKC and its subsidiary Absolics are expected to begin what could become the world’s first commercial production of glass substrates by the end of this year. ...

Market chatter continues to link Apple as a potential early adopter of Intel’s 18A-P for future M-series chips, with more technical details expected to surface at the VLSI Symposium in mid-June. Based on information disclosed on the VLSI website, Intel’s enhanced 18A-P process delivers over 18% ...

As Intel’s EMIB (Embedded Multi-die Interconnect Bridge) advanced packaging gains traction and draws strong market attention, the company is reportedly accelerating capacity expansion globally. An Investor.com report suggests Team Blue is advancing EMIB capacity expansion in parallel, with its Ore...

Apple is reportedly weighing the possibility of having some of its core device chips manufactured by Samsung and Intel. According to Bloomberg, citing sources, the company has held preliminary discussions on using the two as alternative production partners for its main processors—potentially provi...

Intel’s leading-edge nodes, spearheaded by 18A, are gradually building momentum, while its advanced packaging portfolio is also showing clear traction. According to Wccftech, Intel’s EMIB (Embedded Multi-die Interconnect Bridge) has reached 90% yield levels, with Google and Meta Platforms emergi...