While China continues efforts to produce advanced chips without access to ASML’s EUV tools, it is also pushing to reduce reliance on DUV systems. According to the South China Morning Post, Chinese start-up Prinano claims it has validated mass production of photonic chips on 8-inch silicon wafers u...

While Nikon has lost ground in lithography competition with ASML, the Japanese equipment maker is stepping up efforts to diversify into emerging opportunities. According to a company press release, Nikon is targeting the panel-level packaging market through a new high-productivity digital lithograph...

The next phase of South Korea–Netherlands semiconductor cooperation may extend beyond ASML and into silicon photonics. According to Nikkei, Dutch Ambassador to Seoul Peter van der Vliet said the two countries could collaborate on next-generation chip technologies that use light, rather than electr...

While TSMC recently revealed that its upcoming A13 and A12 processes, both targeted for 2029, are not expected to require High-NA EUV lithography, ASML says the first chips produced using the technology may arrive soon. According to Reuters, ASML CEO Christophe Fouquet said the company expects to se...

One of the most closely watched issues in the semiconductor equipment space lately is TSMC’s statement that it does not plan to adopt High-NA EUV systems for its A13 node, scheduled around 2029. The move has sparked debate over whether—and to what extent—this decision could impact ASML’s fut...