[News] ASML Senior Management’s Asian Tour, First Stop Reportedly TSMC

2024-01-09 Semiconductors editor

ASML, a key chipmaking equipment supplier, is reported to have its incoming CEO, Christophe Fouquet, visiting Taiwan soon. According to Commercial Times citing from supply chain sources, it’s suggested that he will meet with TSMC and other related suppliers to discuss next-generation EUV equipment.

In 2008, Christophe Fouquet joined ASML, holding various management positions. He currently serves as Executive Vice President and Chief Business Officer. In April, he will succeed CEO Peter Wennink, who has held the position since July 2013, upon Wennink’s retirement at the completion of his term.

The high-level visit from ASML’s management to TSMC raises questions about whether it pertains to potential orders for the new “High-NA EUV” (High Numerical Aperture Extreme Ultraviolet Lithography System). TSMC has yet to confirm this, but the company is exploring various possibilities, including investments in advanced packaging.

Industry sources indicate that the cost of High-NA EUV exceeds USD 300 million. Considering the cost-effectiveness balance, TSMC is not in a hurry to adopt it. The primary reason is the imminent need to establish a plant in the United States. It is estimated that future capital expenditures will significantly lean towards expanding production facilities overseas.

Under the U.S. chip export restrictions, ASML halted the shipment of EUV equipment to China in 2019. Under continued pressure from the U.S., the company recently canceled some shipments of Deep Ultraviolet Lithography equipment (DUV) to China.

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(Photo credit: ASML)

Please note that this article cites information from Commercial Times