As TSMC accelerates its U.S. expansion with progress on its third Arizona fab, it still has to ship cutting-edge chips—like those for NVIDIA—back to Taiwan for advanced packaging. But that’s set to change. According to MoneyDJ, the foundry giant plans to break ground on two advanced packaging ...

On July 8, Cadence officially announced via its WeChat account that the U.S.-based company has recently decided to expand its collaboration with Samsung Foundry. The two parties have signed a new multi-year IP agreement to extend the deployment of Cadence® memory and interface IP solutions on Samsu...

BelGaN’s GaN power semiconductor plant in Belgium was shut down last year. According to a report from eeNews Europe, three consortia are reportedly interested in acquiring the facility, primarily for photonics applications. The report also notes that the plant had previously focused on automotive ...

Japanese semiconductor manufacturer Rapidus is aiming to achieve mass production of 2nm chips by 2027. The company is expected to deliver its first batch of sample wafers this July and will provide early design tools to customers to assist in the development of prototype products. Mukesh Khare, h...

Huawei's next-gen flagship smartphone, the Mate 80, is expected to launch in the fourth quarter, and all eyes are on the processor it will feature. But according to Wccftech and Chinese outlet IC smart, the device is rumored to come with the Kirin 9030 chip, which is likely to stick with the same 7n...