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AI Boom Drives Surge in Data Center Interconnect Demand; Global Market Value to Grow 14.3% in 2025, Says TrendForce

19 May 2025

TrendForce reports that leading global telecom providers such as SK Telecom and Deutsche Telekom are rolling out Agentic AI services for general users as generative AI becomes increasingly integrated into daily life in 2025. With telecom providers and major CSPs continuing to expand their data center infrastructure, Data Center Interconnect (DCI) technology is gaining significant traction. The global DCI market is projected to grow 14.3% YoY in 2025 to surpass US$40B.

Geopolitical Tensions Fuel a Wave of AI Chip Independence as US and Chinese CSPs Race to Develop In-House ASICs, Redefining the Market Landscape, Says TrendForce

15 May 2025

TrendForce’s latest research reveals that the surge in demand for AI servers is accelerating the pace at which major US CSPs are developing in-house ASICs, with new iterations being released every one to two years. In China, the AI server market is adjusting to new US export controls introduced in April 2025, which are expected to reduce the share of imported chips (e.g., from NVIDIA and AMD) from 63% in 2024 to around 42% in 2025.

Top 10 OSAT Companies of 2024 Revealed—China Players See Double-Digit Growth, Reshaping the Global Market Landscape, Says TrendForce

13 May 2025

TrendForce’s latest report on the semiconductor packaging and testing (OSAT) sector reveals that the global OSAT industry in 2024 faced dual challenges from accelerating technological advancements and ongoing industry consolidation. While ASE holdings and Amkor maintained leading positions, OSAT providers from China, such as JCET and HT-Tech, saw strong double-digit revenue growth—supported by government policies and domestic demand—posing a growing challenge to the existing market order.

Global SiC Substrate Revenue Declines 9% in 2024; Long-Term Demand Remains Strong as 8-Inch Roadmap Gains Momentum, Says TrendForce

12 May 2025

TrendForce’s latest research shows that weakening demand in the automotive and industrial sectors has slowed shipment growth for SiC substrates in 2024. At the same time, intensifying market competition and sharp price declines have pushed global revenue for N-type SiC substrates down 9% YoY to US$1.04 billion.

Mitsubishi Accelerates Electrification, Foxconn Expands Global EV Footprint—A Mutually Beneficial Partnership, Says TrendForce

9 May 2025

Mitsubishi Motors has signed a MOU with Foxconn subsidiary Foxtron Vehicle Technologies to supply EVs for the Australian and New Zealand markets starting in 2026. TrendForce reports that this move not only marks a concrete step in Mitsubishi’s electrification roadmap but also represents a strategic pivot in response to rapid market changes. For Foxconn, having its contract design and manufacturing service (CDMS) model recognized by a global automaker is a milestone with far-reaching implications for future business expansion.


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