According to TrendForce's latest memory industry research, DRAM supply will remain tight through 2027, and uncertainty persists over memory suppliers' HBM4e validation timelines. Together, these constraints are prompting AI chip vendors to scale back the HBM configurations of their next-generation products.
Taiwan’s leading display manufacturers are accelerating factory divestments as they shift away from competing on production scale toward a strategy focused on high-value-added products.
Surging investment in AI infrastructure is expected to drive the combined CapEx of the world’s nine largest CSPs up by approximately 90% YoY in 2026, according to TrendForce’s latest AI server research.
TrendForce’s latest research on the memory industry reveals that AI will remain the primary driver of memory demand in 2027. However, market dynamics are expected to diverge between DRAM and NAND Flash.
According to TrendForce’s latest MLCC industry survey, robust AI demand drove June 2026 shipments from the top three Japanese and Korean suppliers—Murata, Samsung Electro-Mechanics (SEMCO), and Taiyo Yuden—to a five-year monthly high. Concurrently, a sustained spillover of consumer-grade MLCC orders is benefiting distribution channels and suppliers in Taiwan and mainland China, thereby driving up their quotes.
