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According to TrendForce’s latest report, the Breakdown Analysis of China’s Semiconductor Industry, many fabs are being built in China with high capital expenditures, attracting attention from the industry. In particular, new fab construction projects like Silan Microelectronics and CanSemi etc. will intensify the competition and expand the production capacity of the industry. TrendForce estimates that China’s production capacity of 300mm wafer will reach nearly 700,000 pieces per month by the end of 2018, a 42.2% increase from the end of 2017; the revenue from China’s entire wafer fabrication industry is expected to reach RMB 176.7 billion in 2018, an annual growth of 27.12%.
The expanding markets for Internet of Things, automotive electronics, and smart home devices have driven the demand for power management integrated circuit (PMIC) and microcontrollers (MCU), etc., resulting in the 200mm foundries’ less input in LCD driver ICs. WitsView, a division of TrendForce, points out that the foundries have raised their quotes for driver ICs. Consequently, fabless IC companies may also raise their quotes to panel makers by 5~10% due to the cost pressure.
Fingerprint sensors will still be the first choice for most Andriod phones in 2018, since other biometric authentication methods available for Andriod phone makers cannot completely replace fingerprint identification yet, says TrendForce. Meanwhile, in-display fingerprint sensors are expected to make breakthrough this year, and vendors like Samsung, LG, OPPO, Vivo, Xiaomi, Huawei are likely to embed this technology, bringing the global fingerprint sensor penetration rate in smartphones to 60%.
According to the latest report of DRAMeXchange, a division of TrendForce, the price of server DRAM will continue to rise as the supply remains tight in 1Q18. Meanwhile, previous 2133MHz products will be overtaken by higher clock rate (2666MHz and 2400MHz) production, so high-bandwidth server modules will become the mainstream products.
Micron Technology and Intel will discontinue their partnership on NAND Flash development after completing the development of their third generation of 3D-NAND Flash (96-layer), according to their announcements on January 8, 2018. The two will part ways in developing NAND Flash technology due to their individual business needs, but will continue to jointly develop and manufacture 3D XPoint at their fab in Lehi, Utah. DRAMeXchange, a division of TrendForce, points out that 96-layer 3D-NAND Flash will not become the mainstream products until 2019, so this decision of parting ways will not influence their product roadmaps until 2020.
