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The rapid growth of demand for AI semiconductors is driving the evolution of advanced packaging technologies, with Fan-Out Panel-Level Packaging (FOPLP) emerging as a new battleground across the industry. TrendForce reports that TSMC is currently focusing on its Chip-on-Panel-on-Substrate (CoPoS) packaging architecture and has standardized on a 310 × 310 mm panel format.
According to the latest research by global market intelligence firm TrendForce, the OLED monitor market entered a seasonal downturn in 1Q26. Moreover, strong promotional campaigns in 4Q25 had already pulled forward demand. Consequently, global OLED monitor shipments dropped by 11% QoQ in 1Q26. However, from a YoY perspective, 1Q26 shipments actually soared by 78%. The key growth driver was the increasingly abundant supply of QD-OLED panels, which enabled new market entrants to ramp up volumes and effectively fill gaps in the market.
TrendForce’s latest research on the display industry reveals that the foldable smartphone market is expected to see Apple enter as early as the second half of 2026, drawing significant attention to related technological advancements.
Rising semiconductor foundry and outsourced semiconductor assembly and test (OSAT) costs since 2025, along with continued increases in precious metal prices, are placing growing cost pressure on display driver IC (DDIC) suppliers, according to the latest research from TrendForce. In response, some vendors have recently begun discussions with panel makers to evaluate the possibility of adjusting DDIC pricing.
TrendForce’s latest findings show that global OLED monitor shipments hit 2.735 million units in 2025, a 92% YoY increase. This impressive growth was mainly fueled by aggressive promotional efforts by brands in the fourth quarter. Furthermore, 27-inch 240 Hz QHD models gained considerable popularity due to their excellent price-to-performance ratio, significantly increasing shipments. The launch of new 280 Hz models further energized the market.
