While TSMC recently revealed that its upcoming A13 and A12 processes, both targeted for 2029, are not expected to require High-NA EUV lithography, ASML says the first chips produced using the technology may arrive soon. According to Reuters, ASML CEO Christophe Fouquet said the company expects to se...

As AI accelerator leaders such as NVIDIA continue rolling out chips with increasingly larger compute die sizes, panel-level packaging is gaining momentum. Notably, Germany-headquartered SCHMID — an equipment provider for printed circuit board (PCB) and IC substrate manufacturing — said in an Inv...

As demand for high-speed transmission in AI data centers surges, TSMC is further advancing its co-packaged optics (CPO) roadmap. According to Commercial Times, TSMC recently disclosed that its “COUPE on Substrate” solution is expected to enter mass production in the second half of 2026. By exten...

TSMC announced on May 15 that it plans to sell shares in affiliate company Vanguard. According to Commercial Times, the foundry giant intends to sell up to 152 million common shares of Vanguard International Semiconductor Corporation (VIS), equivalent to around 8.1% of Vanguard’s outstanding share...

TSMC held its Taiwan Technology Symposium today. According to Reuters, the company said that demand for AI accelerator wafers is projected to grow 11-fold between 2022 and 2026. TSMC also raised its forecast for the global semiconductor market, now expecting it to exceed US$1.5 trillion by 2030, up ...