Recently, ROHM announced that it will integrate its own R&D and manufacturing expertise in gallium nitride (GaN) power devices with the process technologies of long-term partner TSMC. The company plans to establish a dedicated production system at its Hamamatsu facility by 2027 to meet surging d...

Apple is reportedly showing strong confidence in its upcoming foldable products, which are slated to launch in the second half of the year. According to Economic Daily News, sources say Apple has significantly increased supply chain inventory preparations for its forthcoming foldable phone, raising ...

Conflict in the Middle East triggered by tensions between the U.S. and Iran is rattling energy markets, raising concerns for the semiconductor industry. According to Commercial Times, as demand for AI chips surges, the industry’s reliance on stable power supplies continues to grow. For example, TS...

Major semiconductor companies are reportedly considering easing thickness standards for next-generation HBM, as future generations such as HBM4E and HBM5 are expected to adopt 20-layer stacking. According to ZDNet, while the current HBM4 thickness standard is 775 micrometers (μm), industry discussi...

As chip manufacturing approaches the sub-2nm era, spotting atomic flaws in next-generation silicon grows ever more challenging. Now, Cornell researchers, partnering with foundry giant TSMC and chipmaking tool player ASM, have for the first time directly visualized atomic-scale defects using high-res...