As AI-driven demand continues to strain advanced packaging and testing capacity, SPIL, a subsidiary of ASE, is accelerating its expansion efforts. According to Investor.com, the company has acquired Taiwan Mask Corporation's Zhunan Plant 6 for NT$2.8 billion. Because the facility is already operati...

As Washington continues to tighten restrictions on AI chip exports to China and related entities, its allies are also considering similar steps. According to Bloomberg, Taiwan is weighing significantly stricter controls on AI chip shipments to China in a move to further align with US measures. Th...

Apple's annual Worldwide Developers Conference (WWDC) is set to kick off on June 9. According to Commercial Times, beyond updates to Apple Intelligence, Siri, and macOS 27, market attention is focused on whether a next-generation Mac Studio powered by Apple's M5 Ultra chip will also make an appearan...

As AI chips continue to scale in size and complexity, demand is rising for next-generation packaging and substrate solutions, with glass substrates emerging as a focal point. According to Sisa Journal, the technology is expected to begin early commercialization in 2027, move through a ramp-up phase ...

As Intel advances its High-NA EUV roadmap for its A14 node, market attention has turned to TSMC’s comparatively cautious approach to the cutting-edge lithography tool, which is estimated to cost around US$400 million per system. However, at its June 4 shareholder meeting, TSMC Chairman C.C. Wei...