Intel’s leading-edge nodes, spearheaded by 18A, are gradually building momentum, while its advanced packaging portfolio is also showing clear traction. According to Wccftech, Intel’s EMIB (Embedded Multi-die Interconnect Bridge) has reached 90% yield levels, with Google and Meta Platforms emergi...

One of the most closely watched issues in the semiconductor equipment space lately is TSMC’s statement that it does not plan to adopt High-NA EUV systems for its A13 node, scheduled around 2029. The move has sparked debate over whether—and to what extent—this decision could impact ASML’s fut...

The AI compute race is heating up, pushing advanced packaging to the forefront, with TSMC’s CoWoS emerging as one of the most constrained resources in the global AI supply chain. According to Commercial Times, sources say the average selling price (ASP) of a single CoWoS wafer is around $10,000—...

After being implicated in a 2nm-related trade secrets case involving TSMC engineers, Japanese semiconductor equipment giant Tokyo Electron was also caught up in a separate controversy tied to a Chinese chip tool start-up. According to the Financial Times, Jay Chen—formerly a key figure in its Chin...

TSMC is accelerating its advanced-node capacity expansion. According to Economic Daily News, citing supply chain sources, its Taiwan-based 3nm fabs were originally expected to reach a monthly capacity of 150,000 wafers by the end of 2026, but this is now projected to increase to 180,000 wafers, abou...