Ahead of TSMC’s earnings call later this week, the spotlight is once again on its advanced packaging roadmap—and CoWoS is no longer the only story. According to Commercial Times, TSMC’s CoPoS (Chip-on-Panel-on-Substrate) pilot line has already begun tool deliveries to R&D teams in February...

While Iran and the U.S. have agreed to a ceasefire contingent on guaranteed safe passage through the Strait of Hormuz, the helium crisis across the semiconductor supply chain shows temporary signs of easing. However, as highlighted by Forbes, Qatar’s Ras Laffan Industrial City, which supplies r...

TSMC’s upcoming April 16 earnings call is set to be closely watched, as investors assess whether strong AI demand continues to support revenue momentum. According to Commercial Times, expectations are high that TSMC’s first-quarter revenue will remain above the NT$1 trillion mark. In line with t...

Please note that this article cites information from Commercial Times and Next Apple. As NVIDIA’s Rubin moves into mass production, industry attention is already shifting to the specifications of its next-generation Rubin Ultra. While market rumors suggest that Team Green may integrate four GPU ...

Please note that this article cites information from Commercial Times, The Elec and TSMC. As GPU designs evolve toward denser chip-to-chip connectivity and faster data rates, optical transmission is taking on a bigger role. Foundry giants are also moving in, with TSMC’s COUPE silicon photonics p...