In pursuit of big chip technology, a team from the Chinese Academy of Sciences has designed an advanced 256-core processor system based on 16 chiplets and aims to expand this design to a 1,600-core big chip.

With each new generation of chips, increasing transistor density becomes progressively challenging. Chip manufacturers are exploring various methods to enhance processor performance, including architectural innovations, larger die sizes, multi-chiplet designs, and wafer-scale chips.

In a recent research paper, the Institute of Computing Technology at the Chinese Academy of Sciences has introduced a 256-core multi-chiplet design and further explored wafer-scale methods, constructing a big chip using an entire wafer.

The team presented an advanced 256-CPU multi-chiplet, referred to as the Zhejiang Big Chip, in the paper. This design is composed of 16 chiplets, each housing 16 CPUs based on the RISC-V architecture.

These chiplets are interconnected in a traditional symmetric multiprocessor (SMP) manner through a network-on-chip, so the chiplets could share memory.

Researchers from the Chinese Academy of Sciences stated that this design allows for scalability up to 100 chiplets (or 1,600-core).

Reports indicate that the chiplets are manufactured by Semiconductor Manufacturing International Corporation (SMIC) using 22-nm process technology. However, the power consumption of a 1,600-core component interconnected by an interposer and manufactured using a 22-nm process is not specified.

Researchers have noted that the multi-chiplet design can be applied to supercomputer processors. Within each chiplet, multiple cores are interconnected with ultra-low latency. Additionally, advanced packaging technology benefits the communication between chiplets, minimizing delays and NUMA (Non-Uniform Memory Access) effects in highly scalable systems to the greatest extent possible.

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(Photo credit: SMIC)

One of the shareholders of Shanghai Micro Electronics Equipment Group (SMEE), Zhangjiang Group, recently posted on WeChat, claiming that SMEE had successfully developed a 28nm lithography machine. However, the mentioned text was deleted shortly thereafter.

According to reports from Bloomberg and HK01, recently, Zhangjiang Group posted on the WeChat public account “Hello Zhangjiang,” stating, “As the only domestic enterprise mastering photolithography machine technology, SMEE has successfully developed a 28nm lithography machine.”

However, shortly afterward, the text was modified to “As the only domestic enterprise mastering photolithography machine technology, SMEE is committed to developing advanced lithography machines.”

Reportedly, the lithography machine developed by SMEE is named SSA/800-10W, representing a significant breakthrough for the company.

Tom’s Hardware indicated that SMEE’s successful development of 28nm lithography machine signifies ‘a major leap in China’s quest to close the technological gap in the global chip industry’. However, it is currently unclear when SMEE will be able to mass-produce these devices.

Additionally, the deletion of the information raises questions about the success of mass production once again.

The report further indicates that TSMC has been using 28nm process since 2011, and SMIC adopted it in 2015. Both companies chose equipment from ASML to manufacture chips.

Last year, the U.S. Department of Commerce blacklisted SMEE. Since then, SMEE has been seen as China’s best hope for pursuing the development of advanced manufacturing processes.

The existing SSA600 series from the company can utilize 90nm, 110nm, and 280nm process. The latest equipment from the company is expected to narrow the gap with ASML, potentially reducing the initial lag of at least 20 years.

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(Photo credit: SMEE)

According to TechNews’ report, after a prolonged period of price suppression in the mobile panel market, there has been an upswing in demand since the end of the second quarter, as customer inventories have reached a turning point.

The report further quoted industry sources, stating that the increased demand is notably driven by Huawei’s new models, and other customers initiating stockpiling for new models. This gradual increase in demand is raising AMOLED panel utilization rates, subsequently leading to a price uptick, which is also influencing LTPS LCD panel prices.

Previously reported by IJIWEI, the robust demand for Huawei’s Mate 60 series smartphones is expected to contribute to a total annual smartphone shipment of 40 to 50 million units. This surpasses the previous year’s shipments of 30 million units by 30 to 70%.

Industry insiders cited by South Korean media indicate that Huawei’s shipping target for the next year is 100 million units, surpassing market research company predictions by over 40%, which estimated around 70 million units.

The demand for Huawei’s new smartphone models is on the rise, especially as its high-end products extensively adopt LTPO backplane technology, occupying a portion of panel manufacturers’ capacity. Additionally, other customers initiating preparations for new models have contributed to the surge in demand, bringing China’s AMOLED panel capacity back to 80-90%.

Looking ahead to next year, the demand for AMOLED panels will still need to be monitored, particularly around the Lunar New Year. If demand continues to grow steadily, it will likely support panel prices.

As for the crucial component, OLED DDI (Display Driver IC), the process is gradually shifting from 40nm to 28nm. Currently, only UMC (United Microelectronics Corporation) globally can mass-produce the 28nm HV (High Voltage) process required for OLED DDI, while SMIC (Semiconductor Manufacturing International Corporation) employs the 40nm HV process.

With TSMC (Taiwan Semiconductor Manufacturing Company) set to join the 28nm HV process in 2025, there is no imminent shortage of supply. Therefore, the price increase in AMOLED panels may have limited impact on OLED DDI prices, and the fourth quarter and the first quarter of next year are likely to maintain a stable trend.

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(Photo credit: Huawei)

According to South Korean media The Elec’s report, due to strong demand from Chinese chip manufacturers and wafer foundries, the shortage of photomasks in the market has not eased, and it is anticipated that prices will rise in 2024.

The report notes that most photomask manufacturers, including Japan’s Toppan, DaiNippon Printing, and the U.S.’s Photronics, are currently operating at full capacity with a utilization rate of 100%. Some Chinese chip companies are even willing to pay additional fees to expedite delivery schedules.

In the field of integrated circuits, the function of a photomask is similar to the “film” in a traditional camera. With the collaboration of exposure and development processes in photolithography machines and photoresist, the pre-designed patterns on the photomask are transferred to the photoresist on the substrate, enabling mass production through image replication.

Photomasks play an indispensable role in the semiconductor chip manufacturing process, especially in advanced processes where more intricate circuit patterns require multiple layers of photomasks to aid production. For example, mature processes may require around 30 photomasks, while the latest advanced processes might demand as many as 70 to 80 photomasks to handle.

Currently, Chinese foundry giant SMIC employs Deep Ultraviolet (DUV) technology to produce 7nm chips. Compared to Extreme Ultraviolet (EUV), DUV requires more photomasks for the fabrication of multiple circuit patterns.

Toppan Printing, in its latest quarterly financial report covering July to September, anticipates a continual increase in demand for photomasks throughout 2023. DaiNippon Printing expressed agreement with this assessment in its half-year financial report for the period from April to September.

The graphic dimensions, precision, and manufacturing technology requirements of semiconductor photomasks continue to increase, with only a 3% domestication rate for high-end photomask versions in China. In the preparation of photomasks, the Chinese semiconductor photomask industry faces a situation where high-end equipment and materials are dominated by foreign manufacturers.

In the photomask industry chain, the upstream sector primarily involves equipment, substrates, light-blocking films, and chemical reagents; the midstream sector is photomask manufacturing, and the downstream sector includes chips, flat panel displays, touchscreens, circuit boards, and more.

The urgent demand for domestic substitutes for photomask versions is apparent, and the revenue scale of Chinese photomask manufacturers still has a considerable gap compared to leading overseas manufacturers.

(Photo credit: Toppan)

China is actively investing in chips with a mature process of 20nm and above. According to Chosun Ilbo, some insiders signal a potential shift of over 50% of global mature-node chips production to China within the next 2 to 3 years. As semiconductors focusing on mature process account for 75% of overall chip demand, China’s growing influence in this sector raises significant security concerns.

During the APEC SME Technology Conference and Fair in Qingdao on the 9th of this month, Wei Li, former Vice President of SMIC, emphasized the necessity for China to prioritize the localization of semiconductors with a 20nm process and above. This category includes semiconductors focusing on mature process, where Li acknowledged China’s technology lags behind international counterparts by more than 5 years.

Despite China’s efforts for independent development, the semiconductor industry faces comprehensive restrictions from the United States, heavily relying on imports for materials, equipment, and design software, with only about 10% being domestically produced. China, holding over 1/3 of the global chip market, struggles with a self-sufficiency rate below 15%, hindering its industrial progress, especially with foreign countries imposing export controls on advanced process and equipment.

According to South Korean media reports, concerns have arisen within the industry about the potential impact on the global semiconductor supply chain as China expands its mature processes. Despite the recent surge in demand for advanced chips like AI chips and servers, semiconductors focusing on mature process still constitute 75% of overall demand. These chips are crucial not only in autonomous vehicles, automobiles, and home appliances but also in military applications. If China monopolizes this market, it could lead to a severe security crisis.

China is rapidly increasing its market share in the mature-node chips sector, with the government offering up to a 10-year corporate tax exemption for new domestic semiconductor plants. Last year, SMIC invested USD 8.9 billion in Shanghai to build a 28nm plant.

Data from TrendForce indicates that China plans to construct 32 semiconductor plants by 2024, surpassing Taiwan’s 19 and the United States’ 12.

China’s Wafer Fabs Hits 44 with Future Expansion 32, Mainly Targeting on The Mature Process

China’s Expansion into the mature process market poses big challenges for Korean enterprises. Chinese companies are gaining ground in various sectors, including the image sensor market, encompassing DDI semiconductors used in OLED panels. Beyond manufacturing capabilities, China has achieved noteworthy levels of design expertise in semiconductor technologies.

On the other hand, in previous press release, TrendForce predicted China’s mature process capacity to grow from 29% this year to 33% by 2027. Leading the charge are giants like SMIC, Hua Hong Group, and Nexchip, while Taiwan’s share is estimated to consolidate from 49% down to 42%.

TSMC, UMC, and Samsung are the frontrunners in this technology currently. Yet, Chinese players like SMIC and Nexchip are hot on their heels, swiftly closing the gap. SMIC’s 28HV and Nexchip’s 40HV are gearing up for mass production in 4Q23 and 1H24, respectively—narrowing their technological gap with other foundries.

China’s Share in Mature Process Capacity Predicted to Hit 29% in 2023, Climbing to 33% by 2027, Says TrendForce

As China enhances its influence over mature-node chips, both the U.S. and the EU are contemplating countermeasures. Despite months of discussions, there are still no concrete results regarding these potential measures.
(Image: SMIC)