Amid the rising of emerging applications in the AI market, the booming demands for high-performance computing (HPC), high-bandwidth memory (HBM), CoWoS advanced packaging, and high-performance storage, have energized the wafer foundry industry.

Given the broader applicability of 12-inch wafer in advanced process chips, the global expansion of 12-inch wafer production has accelerated in recent years. Leading companies like TSMC, Intel, UMC, Vanguard International Semiconductor (VIS), SMIC, and Huahong have successively released production capacity.

• VIS’ Singapore 12-Inch Fab Got Approved

On September 4, VIS and NXP jointly announced the approval of their Singapore-based 12-inch wafer fab joint venture by regulatory authorities in Taiwan, Singapore, and other regions.

The joint venture, named VisionPower Semiconductor Manufacturing Company (VSMC), will begin construction of its first 12-inch (300mm) wafer fab in the second half of this year.

VIS estimates that trial production will begin in 2027, with profitability expected by 2029. TSMC will provide technological support, and the market holds a favorable long-term outlook for the company’s operations.

Upon its mass production, both companies may consider building a second fab. Currently, VIS operates five 8-inch fabs located in Taiwan and Singapore. Three of the 8-inch fabs are in Hsinchu, and one in Taoyuan. The average monthly capacity of its 8-inch fabs in 2023 was about 279,000 wafers.

• TSMC Expands Production Worldwide

On August 20, TSMC held a groundbreaking ceremony for its new German fab, ESMC, which is set to begin construction by the end of the year and aims to start production by the end of 2027.

The project involves an investment of over EUR 10 billion and is expected to have a monthly capacity of 40,000 12-inch wafers, utilizing TSMC’s 28/22nm planar CMOS and 16/12nm FinFET process technologies.

In early September, Taiwan’s Ministry of Economic Affairs announced that TSMC plans to build a third fab in Japan to produce advanced semiconductors, with construction expected after 2030.

TSMC’s first fab in Kumamoto, Japan, officially opened on February 24, 2023, and will begin mass production in Q4 this year using 28/22nm and 16/12nm process technologies, with a monthly capacity of 55,000 wafers.

The second fab in Kumamoto is planned, with construction expected to start by the end of this year and operations to begin by the end of 2027, targeting 6/7nm nodes.

Additionally, TSMC’s 2nm fabs in Hsinchu (Fab 20) and Kaohsiung (Fab 22) in Taiwan are scheduled to start mass production next year.

In the U.S., TSMC’s first fab in Arizona is scheduled to begin producing chips using 4nm technology in the first half of 2025. The second fab will produce both 3nm and 2nm chips using next-generation nanosheet transistors, with production starting in 2025.

Plans for a third fab are also underway, with production of chips using 2nm or more advanced processes expected to begin in 2028.

• UMC’s Fab 12i in Singapore has Set Equipment in Place

On May 21, UMC held a ceremony for the settlement of equipment at its expanded Fab 12i in Singapore with the arrival of the first equipment.

UMC has operated 12-inch fabs in Singapore for over 20 years, and in February 2022, it announced the plan to invest USD 5 billion to expand Fab 12i, adding a new 12-inch fab with a monthly capacity of 30,000 wafers, focusing on 22/28nm processes. Mass production is expected by early 2026.

• Toshiba’s 12-Inch Wafer Fab Completed

On May 23, Toshiba Electronic Devices & Memory Corporation announced the completion of its new 300mm power semiconductor manufacturing fab, with a total investment of JPY 100 billion and plans to begin production in March 2025.

The fab will be built in two phases, with the first phase starting production within the 2024 fiscal year. Once fully operational, Toshiba’s power semiconductor capacity will be 2.5 times that of 2021. Equipment installation is underway, with mass production expected in the second half of FY2024.

• Powerchip Begins Construction of Two New 12-Inch Fabs

On March 13, Powerchip held a groundbreaking ceremony for a 12-inch wafer fab in partnership with India’s Tata Group, located in Dholera, Gujarat, with a total investment of INR 910 billion rupees (about USD 11 billion).

The fab will have a monthly capacity of 50,000 wafers and will produce chips using 28nm, 40nm, 55nm, 90nm, and 110nm nodes.

In early May, Powerchip also announced plans for a new 12-inch fab to expand advanced packaging capacity to support growing demand for AI devices. Powerchip’s chairman stated that the company will provide interposers, one of the three components in CoWoS packaging technology.

• Texas Instruments Built Three New 12-Inch Fabs

Texas Instruments is currently expanding its 300mm capacity to meet future demand for analog and embedded processing chips. TI plans to invest USD 30 billion in building up to four interconnected fabs (SM1, SM2, SM3, SM4) in the coming decades.

According to its 2022 roadmap, TI will build six 300mm fabs by 2030, with RFAB2 in Richardson, Texas, and LFAB (acquired from Micron) already starting production in 2022 and 2023, respectively. Two of the Sherman fabs were completed in 2023, with two more planned for 2026-2030.

In addition to the plan mentioned above, TI also announced the plan for a second 300mm fab in Lehi, Utah in February 2023, adjacent to its existing 12-inch fab, with production estimated to begin in 2026, focusing on producing analog and embedded processing chips. These fabs will be combined into one once the construction is completed.

On August 16, Texas Instruments announced that it received USD 1.6 billion in funding from the U.S. CHIPS Act. This funding will be used to build a cleanroom for the SM1 fab and complete the pilot production line, construct a cleanroom for LFAB2 to begin initial production, and build the shell for the SM2 fab.

• Intel Focuses on U.S. Projects in Arizona and Ohio

Intel has disclosed chip expansion plans in multiple regions, including Arizona, New Mexico, Ohio, Oregon, Ireland, Israel, Magdeburg, Malaysia, and Poland. However, due to market challenges and poor financial results, some of Intel’s expansion plans have been delayed.

Currently, Intel is advancing the construction of large semiconductor manufacturing plants in Arizona and Ohio for the production of cutting-edge semiconductors, as well as working on equipment development and advanced packaging projects at smaller facilities in Oregon and New Mexico.

• GlobalFoundries Revved up Investment in the U.S. and Portugal

On February 19, the U.S. government announced a USD 1.5 billion subsidy for GlobalFoundries. According to a preliminary agreement with the U.S. Department of Commerce, GlobalFoundries will establish a new semiconductor manufacturing facility in Malta, New York, and expand its existing Fab 8 plant in the same location.

The facility will leverage manufacturing technology already implemented in GlobalFoundries’ plants in Germany and Singapore to produce automotive chips, effectively introducing mature-node technology into Fab 8.

In February of this year, GlobalFoundries also announced a partnership with Amkor Technology to build a large packaging facility in Portugal.

It plans to transfer the 12-inch wafer-level packaging production line from its Dresden plant to Amkor’s facility in Porto, Portugal, aiming to establish Europe’s first large-scale backend facility. GlobalFoundries will retain ownership of the tools, processes, and IP transferred to Porto.

• China’s 12-Inch Wafer Production Lines Entered New Stages

In China, companies like SMIC, Huahong, CR Micro (Shenzhen), and Zensemi (Guangzhou) are making new progresses in 12-inch wafer production.

SMIC expects its monthly 12-inch wafer capacity to increase by 60,000 by the end of the year.

Huahong is speeding up the construction of its new 12-inch fab in Wuxi, with the first lithography machine installed on August 22, aiming for production in 1Q24.

CR Micro’s 12-inch fab in Shenzhen has entered the stage of equipment installation and debugging, with production expected to start in late 2024.

Zensemi’s 12-inch wafer manufacturing production line has went into production.

Read more

• [News] Wafer Foundry Market Shows Signs of Recovery
• [News] Two Contrasting Trends Emerge in Wafer Foundry Industry

(Photo credit: TSMC)

Recently, wafer foundry market has seen various dynamics from related manufacturers.

TSMC is reportedly planning to build its third plant in Japan, while Samsung has delayed the construction of its Pyeongtaek P4/P5 chip plants to 2026, prioritizing the Texas Taylor wafer plant instead.

Meanwhile, SMIC, Huahong Group, and Nexchip have all released their semi-annual reports, showing steady improvements in capacity utilization rates. SMIC expects its 12-inch monthly capacity to increase by around 60,000 wafers in late 2024 compared to the end of last year.

Huahong is accelerating the construction of its new 12-inch production line in Wuxi, which is expected to start production in the first quarter of next year.

According to a survey by TrendForce, strong demand for AI server has driven the total output value of the world’s top ten wafer foundries to increase by 9.6% quarter-on-quarter in the second quarter, reaching USD 32 billion.

TSMC, Samsung, SMIC, Huahong Group, and Nexchip ranked first, second, third, sixth, and tenth, respectively, among the world’s top ten wafer foundries.

• TSMC Plans to Build the Third Plant in Japan After 2030

J.W. Kuo, head of Taiwan’s economic department, recently stated in an interview that TSMC plans to build its third plant in Japan to produce advanced semiconductors, with the construction expected to commence after 2030.

TSMC’s first plant in Kumamoto, Japan, (Kumamoto P1) is expected to start mass production in 4Q24 (October-December), using 28/22nm and 16/12nm process technologies, with a monthly capacity of 55,000 wafers.

The second planned plant, also located in Kumamoto, is scheduled to commence construction at the end of 2024, with operations starting in late 2027, focusing on 6/7nm processes.

The combined monthly capacity of TSMC’s Kumamoto P1 and P2 is expected to exceed 100,000 wafers. TSMC Chairman C.C.Wei mentioned in June that after the first and second plants are operational, TSMC may consider building a third plant in Kumamoto if the local residents agree.

• Samsung Delays the Construction of Pyeongtaek P4/P5 Plants to 2026, Prioritizing Texas Taylor Plant

Per global media reports on September 2, Samsung has postponed the construction of the second and fourth phase production lines of the Pyeongtaek P4 and P5 plants to 2026. Samsung is currently focusing on building a wafer plant in Taylor, Texas.

It is reported that Samsung did not conduct the necessary financial review for the Pyeongtaek P5 plant by the end of July 2024, leading to delays in the construction plans for both P5 and P4 plants.

However, the first-phase production line of P4 plant, which produces NAND Flash, is expected to start production soon. The third-phase production line is currently under construction, with plans to install power equipment after the Mid-Autumn Festival.

The original plan for P4 plant was to first build a memory production line (Phase 1), then a wafer foundry line (Phase 2), followed by additional memory and wafer foundry lines (Phases 3 and 4) to complete P4 plant.

However, it is reported that the wafer foundry business at this production line failed to meet expectations, prompting Samsung to prioritize the construction of memory production lines.

The sources cited by DRAMExchange revealed that the product lineup for the P4 Phase 2 production line is expected to be finalized between January and February 2025.

The Taylor plant began construction in the first half of 2022 and is expected to put into operation in 2026. The project’s investment scale is approximately USD 17 billion, with wafer manufacturing originally planned for the 4nm node.

However, industry news from June 2024 indicates that Samsung has added 2nm advanced process technology to meet the demand driven by the AI wave.

In April 2024, Samsung signed an agreement with the U.S. Department of Commerce to receive USD 6.4 billion in subsidies under the CHIPS Act.

• SMIC’s Revenue Grows by 23.2% Year-on-Year

Recently, SMIC released its half-yearly financial results, showing that the company achieved a revenue of CNY 26.269 billion, a year-on-year increase of 23.2%.

The net profit attributable to the parent company was CNY 1.646 billion, a year-on-year decrease of 45.1%, and the net profit after deducting non-recurring gains and losses was CNY 1.288 billion, a year-on-year decrease of 27%.

In terms of capacity utilization, SMIC’s 8-inch utilization rate has rebounded. The company stated that its 12-inch capacity has been near full load in recent quarters, with additional effective capacity added in the first half of this year, and the new capacity has been rapidly put into production.

The company’s overall capacity utilization rate increased to 85%, up 4 percentage points from the previous quarter.

These financial results highlight two key indicators that send an important signal to the market. Although SMIC’s profits fell short of expectations, its revenue continued to rise, reflecting signs of recovery in downstream markets.

Beyond the recovery in revenue, the increase in capacity utilization is a major highlight of the report.

Data indicates that the main drivers of SMIC’s revenue turnaround were the smartphone and consumer electronics business, further demonstrating signs of recovery in the semiconductor market.

As to wafer revenue by size, demand for 8-inch wafers has rebounded, with the revenue share increasing to 26%, up 2 percentage points from the previous quarter, while the revenue share for 12-inch wafer is 74%.

Regarding capacity expansion, SMIC expects its 12-inch monthly capacity to increase by around 60,000 wafers by the end of this year compared to the end of last year. SMIC provided guidance for the third quarter, projecting a revenue growth of 13% to 15% quarter-on-quarter, with a gross margin between 18% and 20%.

• Huahong’s Capacity Utilization Rate Exceeded 100% in Q2

Huahong achieved operating income of around CNY 6.732 billion in the first half of the year, a year-on-year decrease of 23.88%. The net profit attributable to shareholders was CNY 265 million, a year-on-year decrease of 83.33%.

It expects third-quarter sales revenue of CNY 500 million to 520 million, with a gross margin between 10% and 12%.

In terms of capacity utilization, Huahong reported that the company’s 8-inch capacity utilization rate surpassed 100% in the second quarter, with the 12-inch capacity utilization rate closed to full capacity.

The overall capacity utilization rate was 97.9%, a significant improvement from 91.7% in the first quarter, but still below the 102.7% capacity utilization rate in the second quarter of last year, indicating that Huahong has not yet returned to its peak level.

On product mix, Huahong’s major revenue contributors are discrete device and embedded non-volatile memory. In the second quarter of this year, the combined revenue share of these two segments was 60.5%.

Regarding production, the company is accelerating the construction of its new 12-inch production line in Wuxi.

In August, Huahong announced that the first phase of Wuxi base currently has a capacity of 94,500 wafers per month, with nearly all process platforms steadily scaling up production.

The second phase of Wuxi, after about a year of construction, is now 80% of completion, with the first equipment installation scheduled for the end of August. The production line is expected to be completed by the end of the year, with capacity to be released starting in the first quarter of next year.

• Nexchip Turned Profitable Compared to the Same Period of Last Year

Nexchip achieved a revenue of CNY 4.398 billion, a year-on-year increase of 48.09%, and a net profit attributable to the parent company of CNY 187 million, turning losses into gains year on year. The company’s gross margin was 24.43%.

Nexchip mainly engages in 12-inch wafer foundry services, providing wafer foundry services for DDIC and other process platforms.

In 1H24, the revenue share from CIS has significantly increased, making it the company’s second-largest product segment, with CIS capacity running at full load.

The company’s current wafer foundry capacity is 115,000 wafers per month, and it plans to expand capacity by 30,000 to 50,000 wafers per month in 2024, focusing on 55nm and 40nm nodes, with a primary focus on advanced CIS.

From a quarter-on-quarter perspective, the semi-annual reports of the three major foundries, SMIC, Huahong, and Nexchip, indicate a gradual upturn in business performance and steady improvement in capacity utilization rate.

Industry sources cited by DRAMExchange suggested that this signals an accelerated speed of recovery in the semiconductor market, and the second half of the year may see more positive surprises.

Read more

• [News] TSMC to Build Third Fab in Japan? The Timing May Be Reportedly after 2030
• [News] Two Contrasting Trends Emerge in Wafer Foundry Industry

(Photo credit: TSMC)

Earlier in July, former ASML CEO Peter Wennick stated that the chip war between the U.S. and China may continue for quite a long time, even for decades. Now his prophecy seems to come true, as the Netherlands is said to ban the semiconductor equipment giant from conducting equipment maintenance and providing related backup components in China, according to the latest report by Bloomberg.

As the targets of the measure reportedly includes ASML’s deep ultraviolet (DUV) lithography systems, if implemented, the move would be a heavy blow to China’s semiconductor industry, especially on the development of advanced nodes, the report notes.

On the other hand, regarding ASML’s sales in lithography units in the second quarter of 2024, China emerged as the largest market, as it contributed 49% of the revenue, higher than South Korea’s 28% and Taiwan’s 11%. Therefore, the reported restriction will be a major setback for the company’s financial performance.

The report from Bloomberg, citing sources familiar with the matter, indicates that the government led by Dutch Prime Minister Dick Schoof is unlikely to renew some of ASML’s licenses for maintenance and the provision of backup components in China, which are set to expire at the end of 2024. These licenses include those related to ASML’s sale of DUV lithography equipment.

The report further suggests that ASML’s products are usually sold with maintenance agreements, which are crucial for the equipment to operate properly and continuously. Therefore, if ASML’s licenses for maintenance and the provision of backup components to China are no longer granted, some equipment may be unable to function properly as early as 2025.

In response to the rumors, both ASML and the Dutch Ministry of Foreign Affairs have declined to comment, Bloomberg notes.

In terms of the reason behind the move, the report states that the decision may be made after the Dutch government received pressure from the U.S. Citing a senior official from the Biden administration, if the super power’s allied countries do not agree to align with Washington on semiconductor controls against China, the U.S. government could propose certain unilateral measures against partner countries, including the use of the Foreign Direct Product Rule (FDPR).

The measure allows the U.S. to control transactions involving foreign products that use U.S. technology, thus is considered to be a tactic leveraged to push its allies, including the Netherlands, Japan and South Korea, to impose restrictions on semiconductor equipment exports to China.

According to a previous report by Reuters, since 2019, ASML has been prohibited from selling its most advanced EUV tool line in China as part of a U.S.-led effort to curb Beijing’s technological and military progress. Afterwards, China had to rely on ASML’s DUV lithography machines to advance in its semiconductor manufacturing technology.

As per a report by Wccftech in May, SMIC seems to be able to use ASML’s old DUV lithography machines to manufacture 5nm chips for Huawei. Therefore, if ASML stops servicing and supplying parts for DUV machines in China in the future, companies like Huawei and its foundry partner SMIC will find it increasingly difficult to make breakthroughs with their existing capabilities.

The latest report by Bloomberg emphasized that ASML’s CFO, Roger Dassen, confirmed in a July earnings call that the company still has employees in the fabs of Chinese customers. Therefore, if the maintenance ban is implemented, ASML will have to withdraw the employees who provide equipment services to Chinese semiconductor companies.

Read more

• [News] ASML Claims the World Counts on China for Legacy Chips; So Do Chip Equipment Giants
• [News] SMIC Reportedly to Manufacture 5nm Chips for Huawei Without EUV Machinery

(Photo credit: ASML)

According to a report from Bloomberg, Applied Materials Inc. pointed out that the U.S. Department of Justice (DOJ) has requested information regarding its federal grant applications, further intensifying the government’s investigation into the company’s operations.

Per a regulatory filing last week, the chip equipment manufacturer received a subpoena from the DOJ and is fully cooperating with the government. Reportedly, the company stated that the request pertains to certain federal award applications and information submitted to the federal government.

Applied Materials had applied for government support for its planned research center under the U.S. CHIPS and Science Act, which was expected to bolster local chip facilities.

Yet, per previous reports by Bloomberg and Tom’s Hardware, the company’s funding application was ultimately denied, leaving the USD 4 billion research center planned for Sunnyvale, California, underfunded.

It is worth noting that though the U.S. keeps tightening the export controls on the semiconductor sector, major chip equipment makers seem to become increasingly dependent on the Chinese market.

Thus, Applied Materials’ dealings with China have already been under government scrutiny. Notably, from February to April, China accounted for 43% of the total sales of Applied Materials, a 22 percentage point increase YoY.

Back in February of this year, Applied Materials had already received subpoenas from the U.S. Securities and Exchange Commission, as well as the U.S. Attorney’s Office for the District of Massachusetts, even before the DOJ subpoena, and was reportedly under investigation for allegedly sending equipment to SMIC, China’s leading chipmaker, through South Korea without export licenses.

Addressing the matter, Applied Materials did not immediately respond to requests for comment.

Read more

• [News] Funding for Applied Materials’ USD 4 Billion R&D Center Reportedly Denied by the U.S. Government

(Photo credit: Applied Materials)

China has turned itself into “the world’s market” for semiconductor, while it eyes to play a crucial role in chip manufacturing by procuring more equipment. The latest reports by Bloomberg and Technews, citing data from China’s General Administration of Customs, indicates that Chinese imports of chip equipment in the first seven months of 2024 hit a new high, totaling USD 26 billion.

It is worth noting that in July 2024, the Netherlands’ total exports to China exceeded USD 2 billion, reporting the second-highest single-month record ever, the reports say, which can be largely contributed to China’s stockpiling of ASML’s systems and other machinery.

Tightening U.S. Export Restrictions May Lead to China’s Import Surge with Mature Nodes Its Major Focus  

The primary reason behind this surge, according to Bloomberg, may likely be that Chinese tech companies are preparing for further export restrictions on advanced chip manufacturing tools launched by the U.S. and its allies.

The report states that Chinese tech companies are particularly focused on purchasing semiconductor equipment for mature process, from companies like ASML, Applied Materials, and Tokyo Electron. The move allows fabs in China to produce chips needed for local industries, primarily the automotive sector.

Most of the equipment was said to be lithography systems used for mature nodes, which are crucial for Chinese foundries like SMIC. The company is rumored to produce 5nm chips for Huawei this year, by using old deep ultraviolet (DUV) lithography machines purchased from ASML.

New Local Fabs Opening up, Driving China’s Chip Making Equipment Procurement

In addition to counter the possible export restrictions from the U.S., the reports state that China’s aggressive procurement may also be due to the expansion wave of fabs this year. According to SEMI’s projection, among the 42 new fabs expected to go online in 2024, China leads by 18, which further boosts the country’s purchase of semiconductor production equipment.

The momentum also drives demand for local semiconductor equipment manufacturers in China. Chinese semiconductor company Advanced Micro-Fabrication Equipment Inc. (AMEC) reported a strong second quarter, with its revenue up 36.46% year-on-year to RMB 3.448 billion. Its etching equipment revenue reached RMB 2.698 billion, a year-on-year increase of 56.68%.

Read more

• [News] ASML Claims the World Counts on China for Legacy Chips; So Do Chip Equipment Giants
• [News] Samsung and SK hynix’s China Revenue Doubled in 1H24, Reportedly Driven by Semiconductor and HBM Demand

(Photo credit: SMIC)