TSMC is strengthening its U.S. advanced packaging supply chain through a new long-term partnership with Amkor. According to an Amkor press release, the two parties have announced a 10-year agreement to enhance advanced packaging capabilities in Arizona and support further investment in the U.S. semi...

Semiconductor giants are accelerating global advanced packaging expansion as demand for AI chips surges, with Southeast Asia emerging as one of the most sought-after hubs. While Intel is set to bring its advanced packaging facility in Malaysia online later this year, Bloomberg reports that Samsung i...

Buzz is building as tech giants like Google and Meta consider Intel’s EMIB advanced packaging, and Team Blue is going full throttle. ETNews reports that Intel is understood to have established its EMIB process at Amkor's Songdo K5 facility in South Korea—its first-ever move to outsource such hig...

Chip packaging and testing giant Amkor Technology has officially broken ground on its new advanced packaging campus in Peoria, Arizona, marking a major expansion of its U.S. manufacturing footprint. Amkor initially planned to invest USD 2 billion to build a packaging and testing plant in the Fiv...

Caught between the newly lifted U.S. export restrictions and China’s pressure on domestic firms not to use the H20, NVIDIA has reportedly asked key suppliers to pause production of the China-focused AI chip, according to Reuters, citing The Information. As per the reports, the U.S. chipmaker to...