According to recent reports from foreign media, the Vietnamese government has officially approved a wafer fab construction project with a total investment of VND 12.8 trillion (approximately $500 million). This will be Vietnam’s first wafer fab, marking a key breakthrough in the country's semicond...

According to a report from Commercial Times, citing the Chosun Daily, global semiconductor manufacturers are accelerating their withdrawal from China and shifting focus to Vietnam, expecting intensified U.S. sanctions on China’s semiconductor industry following Trump’s returns to the White House...

With Trump’s inauguration in January, "Made in America" is expected to dominate, driving an urgent push for semiconductor packaging and equipment companies to relocate to North America. Coupled with TSMC’s Arizona plant set to start mass production early next year, the Commercial Times reports t...

Driven by booming demand for AI chips, TSMC's advanced CoWoS (Chip on Wafer on Substrate) packaging faces a significant supply shortage. In response, TSMC is expanding its production capacity and is considering price increases to maintain supply chain stability. According to a recent report from ...

Recently, Samsung Electro-Mechanics announced that by 2026, the sales share of its high-end Flip Chip Ball Grid Array (FCBGA) substrates for server and artificial intelligence will exceed 50%. FCBGA is an integrated circuit (IC) packaging technology，which involves flipping the chip and connecti...