Buzz is building as tech giants like Google and Meta consider Intel’s EMIB advanced packaging, and Team Blue is going full throttle. ETNews reports that Intel is understood to have established its EMIB process at Amkor's Songdo K5 facility in South Korea—its first-ever move to outsource such hig...

As memory makers push deeper into custom HBM logic dies for the HBM4 era, foundries—led by TSMC—are stepping up with more breakthroughs. German outlet HardwareLUXX reports that TSMC’s custom HBM4E, currently dubbed C-HBM4E, will leap to the N3P node. Along with dropping voltage from 0.8 V to 0...

On November 27, TrendForce successfully hosted the “2026 Top 10 Technology Market Trends & TechFuture Awards 2025,” on which it unveiled annual outlook for wafer foundry, memory, AI server, compound semiconductor, energy storage, AI robotics and other core technology sectors, providing forwa...

Google’s TPUs are emerging as a credible alternative to NVIDIA, and Samsung is reportedly supplying the majority of the HBM fueling that momentum. According to Hankyung, industry sources say Samsung Electronics provides more than 60% of Google’s HBM shipments in 2025 through Broadcom. The report...

Intel is gaining momentum, reportedly locking in major orders from tech giants amid backing from Washington and NVIDIA, boosting market confidence. According to Tom’s Hardware and Commercial Times, Apple is eyeing Intel’s 18A node for M-series chips as soon as 2027, while MediaTek is exploring E...