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Articles


2021-11-16

Explosive Growth of Commercial Opportunities Driven by Metaverse Projected to Generate Improvements in Computing Cores, Telecommunications, and Display Technologies, Says TrendForce

By leveraging advantages such as lifelike interaction and virtual simulation, the metaverse will enable the growth of various applications ranging from virtual meetings, digital modeling and analysis, to virtual communities, gaming, and content creation, in the infancy of its development. According ...

2021-11-16

DRAM Industry’s Revenue Rises by 10% QoQ for 3Q21 Thanks to Slight Shipment Growth and Ongoing Quote Hikes, Says TrendForce

DRAM buyers were aggressively stocking up during 1H21 because quotes began to rise at the start of the year, and there were concerns about shortages in the supply chain, according to TrendForce’s latest investigations. To avoid the risk of a supply crunch, most DRAM buyers kept raising their dema...

2021-11-15

HBM/CXL Emerge in Response to Demand for Optimized Hardware Used in AI-driven HPC Applications, Says TrendForce

According to TrendForce’s latest report on the server industry, not only have emerging applications in recent years accelerated the pace of AI and HPC development, but the complexity of models built from machine learning applications and inferences that involve increasingly sophisticated calculat...

2021-11-12

NEV Market Remains Bullish Across 1Q21-3Q21 Period Against Headwinds, with More Than Four Million Vehicles Sold Globally, Says TrendForce

Total global sales of NEVs (new energy vehicles) for the first three quarters of 2021 (January-September) reached 4.2 million units, with BEVs in particular accounting for 2.92 million units, a 153% YoY growth, according to TrendForce’s latest investigations. Total sales of PHEVs, on the other ha...

2021-11-10

Shortage of Semiconductor Parts, Such As IC Substrates, Becomes Primary Driving Force Behind Development of FOPLP Technology

As the COVID-19 pandemic wreaked havoc on the global electronics supply chain, the packaging and testing operations of mid-range and high-end chips were subsequently confronted with prolonged lead times. This can primarily be attributed to the fact that IC substrate suppliers were unable to raise ou...

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