TSMC’s 3nm node is set for a stronger ramp in 2H26, fueled by surging demand for AI and high-performance computing (HPC), particularly as NVIDIA’s Rubin platform ramps up. Citing analysts, the Economic Daily News reports that 3nm is expected to overtake 5nm in revenue contribution for the first ...

During its Investor Open Day on August 28, TCL Technology detailed its strategic layout in optical communications for the first time. TCL’s management noted that the optical communications industry is on the verge of major development opportunities. The company expects to execute its roadmap fo...

As AI workloads demand ever more memory, DRAM's physical capacity ceiling is becoming the bottleneck. At a September 3rd briefing, Japan's NAND giant detailed how its CXL memory modules expand usable memory capacity while cutting latency by over 90% versus conventional approaches, per EE Times Japan...

A proposed U.S. semiconductor tariff is putting fresh pressure on foreign chipmakers to expand manufacturing in the country. According to Korea JoongAng Daily, citing Politico, the scale of each company’s U.S. chip investment could factor into its tariff treatment. U.S. Commerce Secretary Howard ...

ASML’s EUV lithography systems are critical to advanced-node chipmaking, an area Japan is actively working to strengthen. According to Nikkei, ASML Japan President Shojiro Fujiwara said that the company plans to expand its domestic workforce from 500 to around 700 by 2030 to support growing advanc...