Google has highlighted the growing “memory wall” facing AI computing at SEMICON Taiwan 2026. According to Commercial Times, Nikhil Cherian, Senior Director of Supply Chain Infrastructure at Google Cloud under Alphabet, said the rise of multimodal and mixture-of-experts (MoE) architectures is shi...

As China accelerates its push to develop advanced chipmaking equipment, it still appears to be years behind ASML in lithography technology. Bloomberg and BigGo Finance, citing UBS, report that China could achieve high-volume production of immersion deep ultraviolet (DUV) systems within two to five y...

According to TrendForce’s latest memory spot price trend report, DRAM spot trading remained sluggish this week, with weaker demand for branded DDR5 and DDR4 chips, though firm supplier quotes kept prices elevated. Meanwhile, NAND Flash spot prices remained largely range-bound amid weak consumer de...

As AI chip power consumption rises rapidly, liquid cooling is becoming increasingly important. According to Anue, TSMC Advanced Packaging R&D Director James Chen said at SEMICON Taiwan 2026 that as AI computing performance continues to increase, total system power could rise around sixfold over ...

As the memory boom drives prices higher across DRAM, NAND and end-products, SK hynix is approaching a key growth inflection point: China’s five-year restrictions on its enterprise SSD (eSSD) business are set to reach a turning point at the end of 2026, Yonhap News reports. Restrictions on eSSD Pr...