On August 26, Maxscend Technologies disclosed in an investor relations record that the company is strategically extending its footprint into the optical interconnect sector. Maxscend is currently advancing both optical and electrical chip businesses in parallel, with its silicon photonics process no...

SK hynix’s potential memory investment in Japan could face hurdles despite strong local interest. According to Nikkei, Japanese regions are competing for the investment, with Miyagi Prefecture in northeastern Japan among the local governments seeking to attract an SK hynix chip plant. The Kanto re...

Following Hot Chips 2026 in August, Samsung has revealed fresh details on its next-generation HBM and zHBM at SEMICON Taiwan 2026. On Sept. 1, Jangseok Choi, corporate vice president of Memory Product Planning at Samsung Electronics, said the company’s HBM5 is targeting 2× the performance and 20%...

Intel’s latest 14A progress is drawing attention after CFO David Zinsner said the node’s defect density is improving faster than expected. According to a transcript from Investing.com, Zinsner said at Deutsche Bank’s 2026 Technology Conference that 14A defect density was tracking better than I...

As chipmakers accelerate their push toard advanced nodes, ASML highlighted the growing readiness of High-NA EUV for high-volume manufacturing (HVM) at SEMICON Taiwan 2026, which kicked off this week, TechNews reports, citing Greet Storms, ASML’s senior vice president and head of High-NA EUV produc...