As Intel pushes to expand its foundry footprint beyond its own chips—from advanced packaging (EMIB) to logic manufacturing—memory makers may be exploring a similar diversification away from TSMC. With the base die becoming a key differentiator in the HBM4 era, SK hynix is reportedly considering ...

SEMICON Taiwan 2026 kicks off this week. Central News Agency notes that this year’s exhibition will be the largest on record, with its focus expanding to encompass the data center ecosystem led by cloud service providers (CSPs). This expansion reflects a broader shift toward “full-ecosystem” i...

China’s DRAM leader CXMT has released its first half-year earnings report since going public, swinging into profit with net earnings of RMB 77.6 billion as revenue surged 873.64% YoY to RMB 150.3 billion. Beyond the headline numbers, CXMT’s half-year report offers several other key takeaways. He...

Taiwan’s Powertech Technology is moving to bring panel-level packaging into AI chip production. According to Nikkei, the company plans to begin production at what it says will be the world’s first panel-level chip packaging facility for AI chips as early as 2027, targeting server CPUs, AI comput...

Intel is gaining momentum in advanced packaging, with tech giants such as Google reportedly showing interest in its EMIB (Embedded Multi-die Interconnect Bridge) technology amid ongoing CoWoS supply constraints. Citing CFO David Zinsner’s remarks at Deutsche Bank’s 2026 Technology Conference on ...