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2026-10-13

[News] AI Chip Memory Strategies Diverge: Microsoft’s Maia 300 Fuels HBM4 Demand as Intel Bets on LPDDR5X

Microsoft and Intel unveiled their latest in-house AI accelerators on Monday, stepping up their challenge to NVIDIA with distinct approaches to AI inference performance and efficiency. According to Reuters, Microsoft’s Maia 300 features a multi-chiplet architecture leveraging TSMC’s 2nm process ...

2026-10-13

[News] Vital Technology Group’s Photonics Chip Base Begins Operation in Wuhan

On September 28, Vital Core Optoelectronic Technology (Wuhan) Co., Ltd. , a subsidiary of Vital Technology Group, officially brought its wafer fabrication facility (fab) online in the Wuhan East Lake Free Trade Zone. Serving as the manufacturing core of Vital Technology Group’s CNY 12 billion h...

2026-10-13

[News] Samsung Reportedly Expands zNAND Lineup With zNAND-T and zNAND-I for AI Data Centers and Inference

As AI workloads drive demand for more specialized memory solutions, Samsung Electronics is reportedly expanding its next-generation NAND flash portfolio to meet different performance requirements. According to ZDNet, citing industry sources, the company is in the early stages of developing three zNA...

2026-10-12

[News] Nanya’s 3Q DRAM ASPs Surge Over 60% QoQ as Gross Margin Hits 85.7%; Further Gains Seen in 4Q

Nanya Technology reported strong third-quarter 2026 earnings, driven by surging DRAM prices and robust AI demand. According to MoneyDJ, Nanya reported consolidated revenue of NT$133.65 billion, up 61.9% QoQ. DRAM average selling prices (ASPs) rose more than 60% QoQ, while shipment volume declined by...

2026-10-12

[News] TSMC’s $2B Silicon Interposer Deal with GF Could Fast-Track U.S. Packaging to 1H28, Free Up Fab Capacity

Ahead of TSMC’s earnings call this Thursday, its $2 billion silicon interposer manufacturing deal with U.S. foundry GlobalFoundries is drawing attention. As Commercial Times notes, silicon interposers do not require leading-edge nodes such as 2nm or 3nm. With its existing 65nm interposer platform,...

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