With next-generation HBM advancing, attention is increasingly turning to the commercialization of hybrid bonding. According to The Elec, citing industry sources, Samsung Electronics is establishing a mass production line equipped with around 50 die-to-wafer (D2W) hybrid bonders at its Pyeongtaek cam...

According to TrendForce’s latest memory spot price trend report, DRAM spot prices edged higher this week as branded DDR4 chips attracted more inquiries, though cautious buying and limited supplier willingness kept trading activity subdued. In NAND Flash, the spot market remained under pressure ami...

Wistron officially inaugurated its D1 AI Smart Factory in Fort Worth, Texas, on July 21 (U.S. Central Time). According to Commercial Times, the site is the first in the U.S. to manufacture and mass-produce NVIDIA GB300 Grace Blackwell Ultra Superchips. The nearly US$700 million factory spans approx...

While TSMC said at last week’s earnings call that it would avoid drastic price hikes like the 4–5x increases seen among memory players, Nikkei reports that the foundry giant plans to delay price increases until 2027, giving customers more time to prepare after negotiations. Prices for both advan...

A Chinese research team has developed the world's first neural dynamical system chip based on phase-change memristors, dramatically accelerating complex brain modeling tasks while overcoming a decades-long computational bottleneck in real-time neural dynamics. The chip was jointly developed by a ...