As AI workloads demand greater memory capacity, chipmakers are exploring alternatives to traditional memory architectures. According to ZDNet, industry sources say Groq, the AI chip company that licensed its inference technology to NVIDIA, is considering 3D-stacked DRAM for its next-generation chips...

NVIDIA is advancing its next-generation co-packaged optics (CPO) technology, with prototypes designed to bring optical engines closer to computing chips. According to Wccftech, the company presented its latest optical integration research at SEMICON West 2026 under the theme “Optical Integration f...

As AI-driven demand extends from DRAM to NAND, Samsung and SK hynix are upgrading their key Chinese facilities. According to Reuters, Samsung plans to shift its Xi’an plant from roughly 200-layer to 286-layer V9 NAND, while SK hynix, already authorized to produce up to 240-layer NAND in Dalian, ma...

Apple is expanding its U.S. manufacturing footprint, bringing more domestically sourced components into its latest iPhone lineup and strengthening ties with American suppliers. According to Reuters, Apple announced on October 20 that it has committed to purchasing up to US$100 million worth of titan...

According to TrendForce’s latest memory spot price trend report, the DRAM market showed mixed signals, with DDR5 supply remaining tight despite buyers offering higher prices, while cautious inventory management kept DDR4 trading subdued. In NAND flash, weak demand from module houses and elevated i...