[News] ASML Japan to Boost Workforce 40% by 2030 to Support Rapidus, TSMC Advanced Chip Push

ASML’s EUV lithography systems are critical to advanced-node chipmaking, an area Japan is actively working to strengthen. According to Nikkei, ASML Japan President Shojiro Fujiwara said that the company plans to expand its domestic workforce from 500 to around 700 by 2030 to support growing advanced semiconductor production. Customers include Rapidus, which aims to begin Japan’s first mass production of 2nm chips in fiscal 2027. ASML has already doubled staffing at its Chitose office near Rapidus’ production facility from about 25 employees when it opened in 2024 to around 50, with further increases planned.

Nikkei notes that ASML is considering expanding its presence in Kumamoto Prefecture, where TSMC already operates its first fab and is developing a second. According to Central News Agency, the second fab, originally planned for 6/7nm production, is now set to produce 3nm chips. TSMC is expanding its presence in Kumamoto further, with Reuters reporting that the company and Sony recently announced a US$4.69 billion joint venture for next-generation image sensors, targeting volume production in 2029.

ASML is also seeing significant business growth in Japan. Its lithography system sales in the country climbed roughly 40% in 2025 to €1.2 billion ($1.4 billion). Beyond Rapidus and TSMC, Micron is also deploying ASML equipment at its Hiroshima Prefecture plant, Nikkei adds.

Rapidus Pushes Ahead With 2nm Plans

Rapidus, meanwhile, says its 2nm mass production remains on track. In a Reuters interview, CEO Atsuyoshi Koike said Rapidus is in talks with dozens of potential customers, while several major U.S. tech firms have shown interest and begun evaluations. The company said earlier this year that it had provided a pre-release PDK to early-adopter customers and established an environment for customer prototyping.

Government backing is continuing ahead of the planned mass production. Japan’s Ministry of Economy, Trade and Industry (METI) is seeking an additional JPY 150 billion investment in Rapidus through its Fiscal Investment and Loan Program (FILP), bringing the government’s cumulative investment in the company to JPY 400 billion, according to Reuters.

Read more

• [News] Rapidus Scales Up Advanced Packaging, Targets 8-Reticle Interposers With 600mm Panels by 2030
• [News] Japan’s Rapidus Takes on TSMC With Aggressive 2nm Pricing, Reportedly Targeting up to ¥3.5M per Wafer

(Photo credit: ASML)